Full Site - : copper wiring (Page 9 of 62)

Duplex Industries Ltd

Industry Directory | Manufacturer

Duplex Industries Ltd. produced its first copper lead wire in 1996. Today we are known as the most reliable supplier in copper wire and allied product market in India and internationally.

Juki cable

Juki cable

Parts & Supplies | Tape and Reel

type:34pin、64pin.... length:1.2m、1.5m、 Main material: copper wire Heat resistance: 105 ℃ Suitable for: ICT(TRI、Jet、PTI), automation equipment, circuit board testing machine

Shenzhen PTI Technology CO.,LTD

HIG Handel mit Industrieg�tern GmbH

Industry Directory | Distributor / Manufacturer

We are a supplier of solder and soldering equipment and other products for the electronics industry.

SK Enterprise

Industry Directory |

OEM in Electrical & Electronics Products (AC-DC Power Supplies, AC-AC Adaptors & AC-DC Adaptors). Dealing in Scrap Copper, Aluminium, Wire, Steel, Solder, Iron, Plastic, Electronic Components etc). Dealing in Used Equipments.

Copper Wire Bond Failure Mechanisms.

Technical Library | 2014-07-24 16:26:34.0

Wire bonding a die to a package has traditionally been performed using either aluminum or gold wire. Gold wire provides the ability to use a ball and stitch process. This technique provides more control over loop height and bond placement. The drawback has been the increasing cost of the gold wire. Lower cost Al wire has been used for wedge-wedge bonds but these are not as versatile for complex package assembly. The use of copper wire for ball-stitch bonding has been proposed and recently implemented in high volume to solve the cost issues with gold. As one would expect, bonding with copper is not as forgiving as with gold mainly due to oxide growth and hardness differences. This paper will examine the common failure mechanisms that one might experience when implementing this new technology.

DfR Solutions (acquired by ANSYS Inc)

Crowbar Electrical Parts.com

Industry Directory |

We our an Online Store which sells Cable Ties,Solderless Terminals,Primary Wire,Fuses,Fuseholders,Split Loom,Spiral Wrap,Wire Nuts,Heat Shrink Tubing,Scotchloks,Copper Lugs, Electrical Tape, Speaker Wire and More

Bonding Wire

Bonding Wire

New Equipment | Components

Gold / Aluminum / Copper Bonding Wires The bonding wires is the most important material used in making electrical connections between the chip and the external circuit. It has good conductivity and corrosion resistance, and it could be used for extr

Plastlist Group

FEP FN Polyimide Film for High Temperature Wires ,Magnet Wire Core Wrap & Separator Tape,High Temp Cable & Wire Wrapping

FEP FN Polyimide Film for High Temperature Wires ,Magnet Wire Core Wrap & Separator Tape,High Temp Cable & Wire Wrapping

New Equipment | Materials

Cable Wrapping Polyimide F46 Tape is a dry adhesive tape, which is made by a polyimide film coated with Teflon FEP fluoropolymer adhesive on one side(FH) or both sides (FHF) upon high_temperature baking. Thickness: 0.0375mm, 0.04mm, 0.05mm, 0.06mm

Yancheng Tiandi Insulation Co.,Ltd

KappZapp4™ - Tin-Silver Solder for Stainless Steel to Stainless Steel and Copper

KappZapp4™ - Tin-Silver Solder for Stainless Steel to Stainless Steel and Copper

New Equipment | Solder Materials

KappZapp4™ contains 4% Silver (Ag), and is often preferred for hand soldering Copper wires and tabs. It has a wider slushy or plastic range (430°F-475°F and 221°C - 246°C) to allow users to manipulate parts while the solder joint is cooling and harde

Solder Direct

Signal Transmission Loss due to Copper Surface Roughness in High-Frequency Region

Technical Library | 2015-04-30 20:17:03.0

Higher-speed signal transmission is increasingly required on a printed circuit board to handle massive data in electronic systems. So, signal transmission loss of copper wiring on a printed circuit board has been studied. First, total signal loss was divided into dielectric loss and conductor loss quantitatively based on electromagnetic theory. In particular, the scattering loss due to surface roughness of copper foil has been examined in detail. And the usefulness of the copper foil with low surface roughness has been demonstrated.

Mitsui Kinzoku Group


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