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Circuit Frames

Circuit Frames

Videos

BEST has a variety of standard circuit frame patterns. We also can cross-reference competitive patterns and fabricate custom patterns without very large minimum orders. Call for help in picking the right circuit frame. These are ALL ROHS compliant. A

soldertools.net

YINCAE's New SMT 158N Series withstanding -273°C

Industry News | 2021-02-24 11:47:14.0

YINCAE is excited to announce that we have developed SMT 158N series, including a non-flow, low temperature slow cure and high purity liquid epoxy underfill and capillary underfill encapsulant.

YINCAE Advanced Materials, LLC.

Plasma Etch, Inc.

Industry Directory | Manufacturer / Research Institute / Laboratory / School

Manufacturer of surface deposition and plasma surface cleaning and etching equipment offering reliable, repeatable cleaning and etching of PCBs and other materials.

Bodo Moeller Chemie Corp.

Industry Directory | Distributor

Bodo Moeller Chemie offers solutions for the automotive industry, bonding adhesives and the construction industry in USA. The subsidiary in the USA has also been ISO 9001 certified since 2018. Find us on LinkedIn and Facebook

AI Technology, Inc (AIT) Introduces 3D-TSV Ultra-Thin Wafer Processing Temporary Bonding Adhesive Film

Industry News | 2015-03-20 09:51:33.0

THIN WAFER PROCESSING TEMPORARY BONDING ADHESIVE FILM FOR 3D WAFER INTEGRATION

AI Technology, Inc. (AIT)

FINEPLACER lambda - Flexible Sub-micron Die Bonder

FINEPLACER lambda - Flexible Sub-micron Die Bonder

New Equipment | IC Packaging

The FINEPLACER® lambda is a flexible sub-micron bonder used for precise placement, die attach and advanced packaging. The system offers outstanding flexibility with a modular design and can be easily reconfigured for different applications. The syst

Finetech

CiXi Tian Hao Electric Technic Co.,LTD

Industry Directory |

TianHao company offer a full range of fluid dispensing equipment and consumable that provide the quality results you demand. and Complete robotic dispensing solutions and high precision systems.

Reworkable Edgebond Adhesive Improves CBGA and BGA Thermal Cycle Performance and Eliminates Underfill

Industry News | 2011-04-07 20:23:54.0

Zymet Inc. has introduced a reworkable edgebond adhesive, UA-2605, that improves thermal cycle performance of CBGAs and plastic BGAs. In one trial, UA-2605 tripled the 0°C to +100°C performance of a CBGA, to nearly 2500 cycles. Previously, an underfill was needed to achieve this level of performance.

Zymet, Inc

Connector Gaskets

Connector Gaskets

New Equipment | Materials

Our range of connector gaskets includes precision diecut gaskets made from a large selection of materials, both conductive and non-conductive. The DC Series comprises waveguide and connector gaskets to MIL-C-81511, MIL-C-5015, MIL-C-38999 and MIL-C-

P&P Technology Ltd

Eclipse Industries

New Equipment |  

Eclipse Industries DS-107 Aligner Bonder The DS-107 Aligner Bonder is an ultra-high precision, high or low force aligner bonder. Constructed on a granite platform for superior stability and rigidity, the DS-107 is designed for alignment accuracy of

Eclipse Industries


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