Technical Library | 2020-01-09 00:00:30.0
PCBs have a wide range of applications in electronics where they are used for electric signal transfer. For a multilayer build-up, thin copper foils are alternated with epoxy-based prepregs and laminated to each other. Adhesion between copper and epoxy composites is achieved by technologies based on mechanical interlocking or chemical bonding, however for future development, the understanding of failure mechanisms between these materials is of high importance. In literature, various interfacial failures are reported which lead to adhesion loss between copper and epoxy resins. This review aims to give an overview on common coupling technologies and possible failure mechanisms. The information reviewed can in turn lead to the development of new strategies, enhancing the adhesion strength of copper/epoxy joints and, therefore, establishing a basis for future PCB manufacturing.
Technical Library | 2020-09-30 19:23:47.0
There is an increase in the number of optical sensors and cameras being integrated into electronics devices. These go beyond cell phone cameras into automotive sensors, wearables, and other smart devices. The applications can be lens bonding, waveguide imprinting, or other applications where the adhesive is in the optical pathway. To support these various optical applications, new materials with tailorable optical properties are required. There is often a mismatched refractive index between plastic lenses such as PC (Poly Carbonate), COP (Cyclo Olefin Polymer), COC (Cyclo Olefin Copolymer), PMMA (Poly Methyl Methacrylate), and UV curable liquid adhesive. A UV curable liquid adhesive is needed where you can alter the refractive index from 1.470 to 1.730, and maintain high optical performance as yellowness index, haze, and transmittance. This wide range of refractive index possibilities provides optimized optical design. Using particular plastic lens must consider how chemical attack is occurring during the process. Another consideration is that before the UV curable liquid adhesive is cured, chemical raw component can attack the plastic lens which then cracks and delaminates. We will also show engineering and reliability data which defined root cause and provided how optical performance is maintained under different reliability conditions.
The 3M Wafer Support SystemTM provides a temporary bonding solution to support wafers during conventional thinning operations as well as post thinning operations. The 3M UV curable adhesive is spun on the wafer surface and is used as a bonding agent
Industry News | 2010-05-24 23:09:12.0
FINETECH will exhibit in booth 403 at the Technology Corner of the Electronic Components and Technology Conference (ECTC), scheduled to take place June 2-3, 2010 at the Paris Las Vegas Hotel in Las Vegas.
The FINEPLACER® lambda is a flexible sub-micron bonder used for precise placement, die attach and advanced packaging. The system offers outstanding flexibility with a modular design and can be easily reconfigured for different applications. The syst
New Equipment | Rework & Repair Equipment
BEST has been designing and fabricating circuit frames for sale and for inhouse use for several years. We have both epoxy and dry film circuit frames- you have the choice! In the dry film adhesive system- damaged pads and traces can be replaced witho
Increased Dispense Area over SD6 Series for Underfill, Glob Top, Dam & Fill, LED Packaging, Surface Mount Adhesive Dispensing, etc. Features and Benefits Convenience – With non-contact injection technology, the need to move the z-axis up and down
Career Center | Melbourne, Florida USA | Engineering,Production,Quality Control
Engineering Specialist - Advanced Manufacturing Technology organization Palm Bay, Florida � GCSD01041082 Job Description: Work in the Advanced Manufacturing Technology organization on the development, qualification, and implementation of leading-edg
Eclipse Industries DS-107 Aligner Bonder The DS-107 Aligner Bonder is an ultra-high precision, high or low force aligner bonder. Constructed on a granite platform for superior stability and rigidity, the DS-107 is designed for alignment accuracy of
Industry Directory | Distributor / Equipment Dealer / Broker / Auctions / Manufacturer
Zetech was established in 1986 with the intention of supplying Industrial Equipment, Manufacturing Equipment, Consumable Materials, Software and Technical Support to the Electronics and Manufacturing Industry in South Africa.
