Industry News | 2017-03-22 13:56:25.0
Engineered Material Systems is pleased to debut its 631-39 UV plus thermal cured adhesive for bonding lens holders in camera module applications.
Industry News | 2017-10-18 20:37:52.0
Engineered Material Systems is pleased to debut its 631-68 UV plus thermal cured adhesive for bonding lens holders in camera module applications.
Industry News | 2019-04-16 19:56:44.0
PVA will exhibit at Display Week 2019, scheduled to take place May 14-16, 2019 at the San Jose Convention Center in CA. PVA’s expert in optical bonding, Alex Giordano, will discuss the company’s optical bonding capabilities.
Industry News | 2019-03-31 20:58:34.0
PVA will exhibit at the exhibit at the SMTA Atlanta Expo, scheduled to take place Thursday, April 11, 2019 at the Atlanta Technology Park in Peachtree Corners, GA. Company representatives will discuss PVA’s Jet Coating and Meter-Mix Dispensing System.
Industry News | 2014-05-07 16:11:10.0
AI Technology (AIT) Releases Electrically and Thermally Conductive 20 Micron Wafer Level Die-Attach Film (DAF), Combines High Glass Transition Temperature and Stress Absorption with Proven Thermal Performance in Die-Attach Power Dissipation.
The Dos P016 / 050 / 100 / 300 / TCA piston dispensers are high-precision volumetric dispensers designed to process 1C and 2C materials and cover a wide range of applications. Precisely dimensioned dispensing cylinders provide the ability to obtain r
Molex's membrane switches provide durable, lightweight and low-profile options for integrating user interfaces and electronic components into a variety of applications including medical, industrial and commercial products. Molex standard membrane s
For flip chip attachment or electrical grounding ACP's for Electrical Interconnection Zymet's ACP’s designed for electrical interconnection are used for flip chip attachment. Applications include chip-on-glass (COG) attachment of driver IC's and
Description This product is a kind of laminated board formed through heat pressing after the electric industry fiolax cloth dips into epoxy resin. It is suitable as the mechanical, electric and electronic insulation structural components which are us
ALPHA® TETRABOND™ is the culmination of "frameless" stencil development; an elegantly simple system designed to enhance the rigidity of the foil, making safe mounting and demounting an easier proposition. Innovatively encompassed in a thin, one piece
