Permabond 2-part epoxy adhesives are suitable for bonding a wide variety of materials. Available with a range of different cure speeds to suit, Permabond epoxies have been developed to offer a high standard of performance for demanding bonding applic
Technical Library | 2018-04-05 10:40:43.0
The miniaturization of microchips is always driving force for revolution and innovation in the electronic industry. When the pitch of bumps is getting smaller and smaller the ball size has to be gradually reduced. However, the reliability of smaller ball size is getting weaker and weaker, so some traditional methods such as capillary underfilling, corner bonding and edge bonding process have been being implemented in board level assembly process to enhance drop and thermal cycling performance. These traditional processes have been increasingly considered to be bottleneck for further miniaturization because the completion of these processes demands more space. So the interest of eliminating these processes has been increased. To meet this demand, YINCAE has developed solder joint encapsulant adhesives for ball bumping applications to enhance solder joint strength resulting in improving drop and thermal cycling performance to eliminate underfilling, edge bonding or corner bonding process in the board level assembly process. In this paper we will discuss the ball bumping process, the reliability such as strength of solder joints, drop test performance and thermal cycling performance.
Permabond structural acrylic adhesives are suitable for bonding a wide variety of materials. The rapid, room-temperature cure coupled with high strength and durability make these adhesives ideal for demanding applications where speed and ease of appl
By definition, anaerobic adhesives remain liquid until isolated from oxygen in the presence of metal ions, such as iron or copper. For example, when an anaerobic adhesive is sealed between a nut and a bolt on a threaded assembly, it rapidly "cures" o
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Reains Underfilm is a patented Technology which pre-formed thermoplastic, It corner or edge bonds BGA/LGA/CSP packages to the PCB to improve solder joint reliability. It tape & reel packed and fully automatic pick & place on PCB.
TM230 solderable conductive adhesives are rapid cure, self-filling, self-leveling and self-soldering adhesives which can be used as die attach adhesives for LED, CSP, QFP, among others, to replace conductive adhesives (Ag) or solder materials such as
TM 150 series solderable conductive adhesives is rapid cure, self-filling, self-leveling and self-soldering adhesives which can be used as die attach adhesives for LED, CSP, QFP, and so on, to replace conductive adhesives (Ag) or solder materials suc
The excellent performance and versatility of Permabond's cyanoacrylate adhesives have eliminated many product design and production limitations. Permabond manufactures a full spectrum of cyanoacrylates. Our chemists have perfected this line to perfor
Adhesion Promotion Electronics Coatings Increase the bond strength, eliminate delamination, and improve reliability of difficult to bond substrates. Aculon's non-stick, adhesion promotion and anti-oxidation coatings can be used on a broad range of
LEN 66A is one part 100% solid, super fast UV curable bonding adhesives, which has been designed for lens attachment, protective cover windows and touch screens. It can also be used for LCD lamination and sealing, polarizer lamination and touch scree
