Industry News | 2017-10-18 20:31:57.0
YXLON International is pleased to announce that Keith Bryant, Global Direcompany of the Swiss tech holding, Comet Grouptor Electronics Sales, has been selected to present during productronica Messe München in Germany. Bryant will speak during the SMTA Technical Program in the SMT Speakers Corner (A1.220) on Thursday, Nov. 16, 2017 from 1-1:30 p.m. The presentation will look at the advantages that cross over X-ray systems, like the YXLON FF35 CT, bring to CT imaging in electronics failure analysis and in-depth fault finding. Bryant will discuss the latest technologies and show stunning reconstructions.
Industry News | 2021-11-22 06:40:32.0
Three Indium Corporation experts will present on the evolution of high-temperature lead-free solders, thermal management challenges for advanced packaging, and give a sponsored presentation on the company's high-performance, high-reliability materials during the virtual Electronics Packaging Technology Conference (EPTC), Dec. 1-3.
Electronics Forum | Thu Dec 07 03:21:54 EST 2006 | Guest
Materials you see are corner bond adhesive, main purpose of this is mechanical shock absorber , it promotes additional adhession to lessen stress to solder joints incase device subjected to mechanical stress like dropping.By function, corner bond
Electronics Forum | Wed Dec 06 21:59:37 EST 2006 | SMTrework
Hello, we rework BGA packages that come back from the field. I've seen on occasion a black and or red "epoxy" substance from the manufacturer on the corner of some board's BGA chips that I imagine are applied to increase corner bond of the chip to th
Electronics Forum | Thu Dec 07 19:54:55 EST 2006 | davef
We agree with "guest" above. This a "chip bonder" type material used to improve the reliability of array type devices. "A relative comparison of the N50 values is given below: No underfill = 1.0X (baseline) Corner bond = 1.3X Non reworkable underfi
Electronics Forum | Wed Mar 04 22:57:05 EST 2009 | davef
Underfill epoxies may be classified into major groups [Capillary Underfill Manufacturing Development and Characterization for 2nd Level Electronic Interconnect Processes; B Salom�n; University of Puerto Rico, Mayaguez Campus; Dec 2004]: * Capillary.
Electronics Forum | Wed Jul 15 12:31:20 EDT 2009 | rwyman
Depending on the end use of the PCB, edge or corner bonding may be adequate. Much easier to rework as the material is only at the perimeter of the part. We don't do underfill of any degree in-house but a few years ago we did build a limited run of
Electronics Forum | Wed Sep 09 21:20:26 EDT 1998 | Simon Ting
hi, 1206 capacitor with silver/palladium termination is mounted onto a ceramics substrates. Bonding is achieved through conductive epoxy. We discovered that the epoxy cracked and this caused missing capacitor. We had tried different grade of epoxy,
Electronics Forum | Thu Sep 10 09:47:15 EDT 1998 | Earl Moon
| hi, | 1206 capacitor with silver/palladium termination is mounted onto a ceramics substrates. Bonding is achieved through conductive epoxy. | We discovered that the epoxy cracked and this caused missing capacitor. We had tried different grade of e
