Industry Directory | Manufacturer
PCB Repairs of all kinds including-Solder on Tab (Solder Removal, Gold Plating), PTH & Delam repairs, etc.
Design and manufacturer of specialty tooling for the PCBA industry. Primary products include wave, smt, press, and conformal coat fixtures.
Poor handling procedures may sometimes damage corners and edges on printed circuit boards. Most of these types of damage to PCB's can be repaired using the BEST Board Repair Kit. This versatile repair kit along with our clear "how to" instructions of
Used SMT Equipment | In-Circuit Testers
Leader LT436 The Leader LT436NP is the direct replacement. Please follow the link below to view the LT436NP NTSC Pattern Generator The LT 436 an Analog Test Signal Generator offers a 1000 line monoscope incorporating colorbars, gray scale,
New Equipment | Board Handling - Storage
Protektive Pak's Super Tek-Tray stacks and nests together for ease in storing or transporting assemblies. Super Tek-Tray is made of static dissipative impregnated corrugated with reinforced "Plastek" corners. Tek-Tray has static dissipative foam lami
We can design and manufacture the tips for die attach of transistor, LED and other small die applications based on customer's demands. Die Collets common tip style& feature; Conical Tip Rectangular Tip Internal Corner Relief or Ext
Industry Directory | Consultant / Service Provider / Manufacturer
We are a research and development company founded on discovering ways to apply new technology to existing issues in order to continuously solve problems and improve operations within every industry.
Technical Library | 2018-04-05 10:40:43.0
The miniaturization of microchips is always driving force for revolution and innovation in the electronic industry. When the pitch of bumps is getting smaller and smaller the ball size has to be gradually reduced. However, the reliability of smaller ball size is getting weaker and weaker, so some traditional methods such as capillary underfilling, corner bonding and edge bonding process have been being implemented in board level assembly process to enhance drop and thermal cycling performance. These traditional processes have been increasingly considered to be bottleneck for further miniaturization because the completion of these processes demands more space. So the interest of eliminating these processes has been increased. To meet this demand, YINCAE has developed solder joint encapsulant adhesives for ball bumping applications to enhance solder joint strength resulting in improving drop and thermal cycling performance to eliminate underfilling, edge bonding or corner bonding process in the board level assembly process. In this paper we will discuss the ball bumping process, the reliability such as strength of solder joints, drop test performance and thermal cycling performance.
Learn More: https://high-techconversions.com/product-category/cleanroom-sticky-mats/ Watch this Step by Step Instructions by the leading manufacturer of cleanroom sticky mats, tacky floor mats for cleanroom, residential or industrial use.
The decision whether to use a Die Collet or a Pick-up Tool is crucial to the success of the die bonding process and we provide custom tools designed for coping with special die geometries and other process limitations. We can design and manufacture
