Used SMT Equipment | General Purpose Test & Measurement
Agilent-Keysight 16903A Logic Analysis System The Agilent 16903A logic analysis system provides high-performance, system-level debugging of digital designs. Expandability is the key to the system´s long-term value. Customize this system for you
Technical Library | 2020-10-18 19:35:05.0
Interconnect reliability especially in BGA solder joints and compliant pins are subjected to design parameters which are very critical to ensure product performance at pre-defined shipping condition and user environment. Plating thickness of compliant pin and damping mechanism of electronic system design are key successful factors for this purpose. In additional transportation and material handling process of a computer server system will be affected by shock under certain conditions. Many accessories devices in the server computer system tend to become loose resulting in poor contact or solder intermittent interconnect problems due to the shock load from the transportation and material handling processes.
Technical Library | 2022-10-31 17:30:40.0
This paper presents a quantitative analysis of solder joint reliability data for lead-free Sn-Ag-Cu (SAC) and mixed assembly (SnPb + SAC) circuit boards based on an extensive, but non-exhaustive, collection of thermal cycling test results. The assembled database covers life test results under multiple test conditions and for a variety of components: conventional SMT (LCCCs, resistors), Ball Grid Arrays, Chip Scale Packages (CSPs), wafer-level CSPs, and flip-chip assemblies with and without underfill. First-order life correlations are developed for SAC assemblies under thermal cycling conditions. The results of this analysis are put in perspective with the correlation of life test results for SnPb control assemblies. Fatigue life correlations show different slopes for SAC versus SnPb assemblies, suggesting opposite reliability trends under low or high stress conditions. The paper also presents an analysis of the effect of Pb contamination and board finish on lead-free solder joint reliability. Last, test data are presented to compare the life of mixed solder assemblies to that of standard SnPb assemblies for a wide variety of area-array components. The trend analysis compares the life of area-array assemblies with: 1) SAC balls and SAC or SnPb paste; 2) SnPb balls assembled with SAC or SnPb paste.
Industry News | 2016-03-30 08:12:07.0
Akrometrix today introduced the latest generation Digital Image Correlation (DIC) module for both its AXP and PS200 platforms.
New Equipment | Test Equipment
Agilent/HP 1652B 80 CH. Logic Analyzer/ 2CH Digital Scope. The HP 1652B logic analyzer has all the features fo the HP 1650B and HP1651B plus two 400 MSa/s digitizing oscilloscope channels, automatic pulse parameter measurements, and time-correlate
New Equipment | Test Equipment
Agilent/HP DSO9064A Oscilloscope: 600 MHz, 4 Analog Channels Agilent’s Infiniium DSO9064A, equipped with a 15” XGA display, comes in a package that is just 9” (23 cm) deep and weighs only 26 (11.8 kg) pounds to preserve your limited bench space. Th
New Equipment | Test Equipment
Agilent 54815A 4 Ch. 500 MHz Infiniium Oscilloscope. The familiar user interface of the Agilent 54815A Infinium Oscilloscope makes it easy to take advantage of the performance inside. The Agilent Infiniium 54815A provides the versatility and perfor
New Equipment | Test Equipment
Description The Infiniium family's Agilent 54845A provides the performance you need for your most demanding signals. 1.5 GHz bandwidth and a sample rate of up to 8 GSa/s ensure fast, accurate capture of your waveforms. Like the other Infiniium mode
New Equipment | Test Equipment
The TherMoiré® PS200S is a metrology solution that utilizes the shadow moiré measurement technique combined with automated phase-stepping to characterize out-of-plane displacement for samples up to 150 mm x 200 mm. With time-temperature profiling cap
New Equipment | Surface Finish
The MARCH AP Batch Series system offers high-performance plasma treatment for batch manufacturing and R&D environments. The AP-600 and AP-1000 plasma treatment systems suit various plasma cleaning, surface activation, and adhesion improvement applic
