Technical Library | 2021-07-27 14:57:18.0
It should be noted that this is an overview paper that represents the early stages of an ongoing investigation into the causes and effects between conductive anodic filament (CAF) formation and printed wiring board (PWB) material damage. Our belief is that certain or specific types of material damage can increase the propensity for CAF formation. The preliminary data collected suggests is that there is no statistical correlation between the general definition of material damage (cohesive failure) and CAF. The resulting dichotomy is that we find no CAF failures in some coupons that have obvious material damage and we find CAF failures in coupons that don't exhibit material damage.
Industry News | 2021-10-18 15:09:32.0
Insituware LLC is pleased to announce that Morgan Miller, Application Engineer, will present during the SMTA International Conference, scheduled to take place Nov. 1-4, 2021 at the Minneapolis Convention Center. Ms. Miller will present: "Correlation of Solder Paste Electrochemical Impedance Spectroscopy (EIS) Measurements to Solder Paste Inspection (SPI) Performance."
PicoScope 6000E Series oscilloscopes address complex waveform analysis challenges with up to 500 MHz bandwidth, 8 to 12 bits of vertical resolution and up to 4 gigasamples of deep capture memory. 21 serial protocol decoder / analyzers included as sta
Technical Library | 2016-10-20 18:13:34.0
Pad cratering failure has emerged due to the transition from traditional SnPb to SnAgCu alloys in soldering of printed circuit assemblies. Pb-free-compatible laminate materials in the printed circuit board tend to fracture under ball grid array pads when subjected to high strain mechanical loads. In this study, two Pb-free-compatible laminates were tested, plus one dicycure non-Pb-free-compatible as control. One set of these samples were as-received and another was subjected to five reflows. It is assumed that mechanical properties of different materials have an influence on the susceptibility of laminates to fracture. However, the pad cratering phenomenon occurs at the layer of resin between the exterior copper and the first glass in the weave. Bulk mechanical properties have not been a good indicator of pad crater susceptibility. In this study, mechanical characterization of hardness and Young’s modulus was carried out in the critical area where pad cratering occurs using nano-indentation at the surface and in a cross-section. The measurements show higher modulus and hardness in the Pb-free compatible laminates than in the dicy-cured laminate. Few changes are seen after reflow – which is known to have an effect -- indicating that these properties do not provide a complete prediction. Measurements of the copper pad showed significant material property changes after reflow.
Industry News | 2008-03-20 14:35:30.0
MINNEAPOLIS - March 2008 - CyberOptics Corporation (Nasdaq: CYBE) announced that it will feature Process Insight statistical process control (SPC) software in booth 2215 at the upcoming APEX 2008 exhibition and conference, scheduled to take place April 1-3, 2008, in Las Vegas.
New Equipment | Test Equipment
3D Deformation Measurement with Akrometrix TherMoiré and Digital Fringe Projection. Akrometrix' patented TherMoiré systems are the industry leading tools for advanced characterization of temperature-dependent warpage. First introduced in 1998 for us
Left: This part looked ok to the naked eye. Right: A microscopic view shows evidence of this part being previously soldered or reworked. Another part caught and prevented from being a potential problem for our customer. Decapsulation, Pinpri
Conveniently view and share profiles on mobile devices Software Description Auto-Focus Power™ is a ‘recipe search engine’ with an intelligent database Every manual profile will populate the database. The correlations between the oven properties,
Eliminate manual periodic profiling KIC Vision² utilizes temperature and speed sensors embedded in the oven for consistent and accurate profile measurements of the processed PCB Programming and Frequencies A single manual profile run wit
Used SMT Equipment | X-Ray Inspection
X-Ray inspection system SAM is a high resolution x-ray system designed to address the inspection needs of BGA, CSP, flip Chip, semiconductors, and multi-layer board registration. SAM has created the HT for process development, process monitoring
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