Technical Library | 2016-10-20 18:13:34.0
Pad cratering failure has emerged due to the transition from traditional SnPb to SnAgCu alloys in soldering of printed circuit assemblies. Pb-free-compatible laminate materials in the printed circuit board tend to fracture under ball grid array pads when subjected to high strain mechanical loads. In this study, two Pb-free-compatible laminates were tested, plus one dicycure non-Pb-free-compatible as control. One set of these samples were as-received and another was subjected to five reflows. It is assumed that mechanical properties of different materials have an influence on the susceptibility of laminates to fracture. However, the pad cratering phenomenon occurs at the layer of resin between the exterior copper and the first glass in the weave. Bulk mechanical properties have not been a good indicator of pad crater susceptibility. In this study, mechanical characterization of hardness and Young’s modulus was carried out in the critical area where pad cratering occurs using nano-indentation at the surface and in a cross-section. The measurements show higher modulus and hardness in the Pb-free compatible laminates than in the dicy-cured laminate. Few changes are seen after reflow – which is known to have an effect -- indicating that these properties do not provide a complete prediction. Measurements of the copper pad showed significant material property changes after reflow.
Industry News | 2008-03-20 14:35:30.0
MINNEAPOLIS - March 2008 - CyberOptics Corporation (Nasdaq: CYBE) announced that it will feature Process Insight statistical process control (SPC) software in booth 2215 at the upcoming APEX 2008 exhibition and conference, scheduled to take place April 1-3, 2008, in Las Vegas.
Used SMT Equipment | X-Ray Inspection
X-Ray inspection system SAM is a high resolution x-ray system designed to address the inspection needs of BGA, CSP, flip Chip, semiconductors, and multi-layer board registration. SAM has created the HT for process development, process monitoring
Used SMT Equipment | X-Ray Inspection
X-Ray inspection system SAM is a high resolution x-ray system designed to address the inspection needs of BGA, CSP, flip Chip, semiconductors, and multi-layer board registration. SAM has created the HT for process development, process monitoring
Used SMT Equipment | In-Circuit Testers
Tektronix MSO4104 Mixed Signal Oscilloscope Features & Benefits Key Performance Specs 1 GHz, 500 MHz, 350 MHz Bandwidth Models 2 or 4 Channel Digital Phosphor Oscilloscopes 16 Digital Channels (MSO4000) Suite of Advanced T
Used SMT Equipment | In-Circuit Testers
48,000 Spectrum Measurements per Second * Tektronix Exclusive Frequency Mask Trigger (FMT) Offers Easy Event-based Capture of Transient RF Signals by Triggering on Any Change in the Frequency Domain * DC to 8 GHz Frequency Range * All Signals in S
Used SMT Equipment | In-Circuit Testers
Tektronix RSA3408BThe Tektronix RSA3008B Real Time Spectrum Analyzer makes it easy to discover design issues that other analyzers may miss. The DPX Live RF spectrum display offers an intuitive live color view of signal transients changing over time i
Used SMT Equipment | In-Circuit Testers
Tektronix P6980 Logic Analyzer Probe With the industry’s lowest capacitance, the P6800 and P6900 Series logic analyzer probes for the TLA7000 Series protect the integrity of your signal critical for connecting to fast buses like DDR2 and DDR3 w
Used SMT Equipment | In-Circuit Testers
Tektronix TLA7012-18 The TLA7000 Series mainframes can be used as either master or expansion mainframes (TL708EX 8-port Instrument Hub and Expander is required for 3-8 mainframes connected together using TekLink™ cable) TLA7012: Up to eight TL
Used SMT Equipment | In-Circuit Testers
Tektronix P6980 Logic Analyzer Probe With the industry’s lowest capacitance, the P6800 and P6900 Series logic analyzer probes for the TLA7000 Series protect the integrity of your signal critical for connecting to fast buses like DDR2 and DDR3 w
