ORPRO Vision SPI Presentation. This presentation introduces the methods and technology used by ORPRO Vision in the Symbion P36 Plus SPI system. For additional information, please contact ORPRO Vision at sales.us@orprovision.com sales.eu@orprovision
Industry News | 2012-09-13 19:22:34.0
CyberOptics Corporation (Nasdaq: CYBE) will feature its newest range of AOI and SPI systems in Booth #347 at the upcoming SMTA International Conference and Expo
Industry News | 2012-10-16 08:42:41.0
CyberOptics Corporation (Nasdaq: CYBE) will highlight the QX100™ at the SMTA Penang Tabletop Exhibition, scheduled to take place November 16, 2012 in the Ball Room, table 17 at the Eastin Hotel Penang, Malaysia.
Industry News | 2015-02-25 14:44:00.0
Vi TECHNOLOGY announces that it has been awarded a 2015 NPI Award in the category of Software – Process Control for its Sigma Review Software. The award was presented to the company during a Tuesday, Feb. 24, 2015 ceremony that took place at the San Diego Convention Center during the IPC APEX EXPO.
Industry News | 2015-04-21 16:47:21.0
Vi TECHNOLOGY is pleased to announce that it was awarded a 2015 SMT China Vision Award in the category of Software – Process Control for its Sigma Review Software. The award was presented to the company during an April 21, 2015 ceremony at the Shanghai World Expo Exhibition & Convention Center during NEPCON China.
Industry News | 2015-04-22 15:03:58.0
Vi TECHNOLOGY announces that it has been awarded a 2015 EM Asia Innovation Award in the category of Test & Measurement / Inspection Systems – SPI for its Sigma Review Software. The award was presented to the company during an April 22, 2015 ceremony at the Shanghai World Expo Exhibition & Convention Center during NEPCON China.
Industry News | 2020-01-05 17:14:24.0
Insituware LLC will exhibit at the 2020 IPC APEX EXPO, scheduled to take place Feb. 4-6, 2020 at the San Diego Convention Center in California. The company will showcase the Vision MARK-1 and Vision product family in Booth #1048.
Technical Library | 2014-08-19 15:39:13.0
Understanding warpage of package attach locations on PCBs under reflow temperature conditions is critical in surface mount technology. A new industry standard, IPC 9641, addresses this topic directly for the first time as an international standard.This paper begins by summarizing the sections of the IPC 9641 standard, including, measurement equipment selection, test setup and methodology, and accuracy verification. The paper goes further to discuss practical implementation of the IPC 9641 standards. Key advantages and disadvantages between available warpage measurement methods are highlighted. Choosing the correct measurement technique depends on requirements for warpage resolution, data density, measurement volume, and data correlation. From industry experience, best practice recommendations are made on warpage management of PCB land areas, covering how to setup, run, analyze, and report on local area PCB warpage.The release of IPC 9641 shows that flatness over temperature of the package land area on the PCB is critical to the SMT industry. Furthermore, compatibility of shapes between attaching surfaces in SMT, like a package and PCB, will be critical to product yield and quality in years to come.
Technical Library | 2015-02-12 16:57:56.0
Electronic systems are known to be affected by the environmental and mechanical conditions, such as humidity, temperature, thermal shocks and vibration. These adverse environmental operating conditions, with time, could degrade the mechanical efficiency of the system and might lead to catastrophic failures.The aim of this study is to investigate the mechanical integrity of lead-free ball grid array (BGA) solder joints subjected to isothermal ageing at 150°C for up to 1000 hours. Upon ageing at 150°C the Sn-3.5Ag solder alloy initially age-softened for up to 200 hours. This behaviour was linked to the coarsening of grains. When aged beyond 200 hours the shear strength was found to increase up to 400 hours. This age-hardening was correlated with precipitation of hard Ag3Sn particles in Sn matrix. Further ageing resulted in gradual decrease in shear strength. This can be explained as the combined effect of precipitation coarsening and growth of intermetallic layer. The fractured surfaces of the broken solder balls were also investigated under a Scanning Electron Microscope. The shear failures were generally due to ductile fractures in bulk solders irrespective of the ageing time.
Technical Library | 2017-07-13 16:16:27.0
Controlled humidity and temperature controlled surface insulation resistance (SIR) measurements of flux covered test vehicles, subject to a direct current (D.C.) bias voltage are recognized by a number of global standards organizations as the preferred method to determine if no clean solder paste and wave soldering flux residues are suitable for reliable electronic assemblies. The IPC, Japanese Industry Standard (JIS), Deutsches Institut fur Normung (DIN) and International Electrical Commission (IEC) all have industry reviewed standards using similar variations of this measurement. (...) This study will compare the results from testing two solder pastes using the IPC-J-STD-004B, IPC TM-650 2.6.3.7 surface insulation resistance test, and IPC TM-650 2.3.25 in an attempt to investigate the correlation of ROSE methods as predictors of electronic assembly electrical reliability.
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