Industry News | 2009-03-10 00:30:31.0
Siemens Electronics Assembly Systems will introduce the Siplace X-Series powered by the new Siplace CPP MultiStar placement head at APEX 2009 in Booth #1458. The new Siplace X-Series powered by Siplace MultiStar delivers the ideal combination of chip shooting speed along with extensive component range capability required for flexible end of line placement. This �all-in-one� solution, called Collect & Pick & Place (CPP) enables electronics manufacturers to simplify line setup and programming, eliminate the need for line reconfiguration or head changes, and ensures optimal line balancing for higher productivity and lower operational costs.
Industry News | 2013-02-08 17:27:30.0
The Production Systems Division (PSD) of Hitachi High Technologies America, Inc. (HTA) announces the introduction of the first true innovation in the SMT component placement market in years with the industry's first automatic self-loading feeder, the SL. The 8mm SL Feeder provides splice-free continuous operation and resolves issues that have plagued electronics assembly customers for years caused by component reel splicing, including improperly spliced tape that interrupts production, and higher material and labor costs.
Industry News | 2011-06-07 14:16:50.0
Juki Corporation recently received an order from ACD (Automated Circuit Design) for its IFS-X2 RFID-based intelligent feeder platforms.
Career Center | Fremont, California USA | Engineering
Job Description: • Has full ownership of HW design and release including HW specification creation, schematic generation, PCB layout, board bring up, and design verification. • Complete PCB design schematic using Orcad capture. • Complete HW desig
Used SMT Equipment | In-Circuit Testers
Advantest R3162 Base Frequency: 9 KHz Max Frequency: 3 GHz Spectrum Analyzer; 9 kHz to 8GHz The R3132/3132N/3162 are a low-cost implementation of the key performance of a portable spectrum analyzer manu-factured to address a variety of mea-surem
Industry News | 2009-08-19 13:06:06.0
Extending its capabilities for placing solder spheres at high speed, DEK’s proven DirEKt Ball Placement™ process now enables accurate solder sphere deposition for spheres as small as 200µm in diameter with pitches as tight as 300µm. With the ability to achieve this accuracy and precision at a first pass yield of over 99.99%, DirEKt Ball Placement delivers the speeds necessary for modern package manufacture without sacrificing anything in the way of performance.
Industry News | 2010-04-12 17:20:44.0
Universal Instruments has bolstered its Dimensions line software suite with the introduction of Linechart™ – a performance-monitoring software module designed to increase utilization rates to over 90%. This new multi-vendor reporting software provides complete visibility into all production lines and quickly identifies factory inefficiencies.
Industry News | 2010-03-24 22:14:43.0
Real capacity on demand requires that capacity can not only be added quickly, but also be reduced with a great deal of flexibility when it is no longer needed. That’s why SIPLACE’s new business models, which permit the short-term and intermediate-term renting of replaceable gantries, raise so much interest among electronics manufacturers. Under the general term "Rent-a-Gantry", SIPLACE offers two capacity-on-demand business models for meeting the customer’s specific needs.
The Lowest Cost APS with Vision Centering and True Universal Support-- Under $90K! https://bpmmicro.com/3901aps/ The 3901 is the feature-rich Automated Programming System offering precise vision alignment and true universal programming technology a
