Industry Directory | Manufacturer
We provide screen printers with the best performance and quality through advanced technology
Technical Library | 2016-06-16 15:29:31.0
Embedding components within the PC board structure is not a new concept. Until recently, however, most embedded component PC board applications adapted only passive elements. The early component forming processes relied on resistive inks and films to enable embedding of resistor and capacitors elements. Although these forming methods remain viable, many companies are choosing to place very thin discrete passive components and semiconductor die elements within the PC board layering structure. In addition to improving the products performance, companies have found that by reducing the component population on the PC board's surface, board level assembly is less complex and the PC board can be made smaller, The smaller substrate, even when more complex, often results in lower cost. Although size and cost reductions are significant attributes, the closer coupling of key elements can also contribute to improving functional performance.This paper focuses on six basic embedded component structure designs described in IPC-7092.
Industry Directory | Manufacturer
China-based EMS, world-class quality standards, to meet a wide range of manufacturing needs, prototype to mass production
Events Calendar | Wed Mar 04 00:00:00 EST 2020 - Thu Mar 05 00:00:00 EST 2020 | San Jose, California USA
eSMART Factory Conference
Technical Library | 2010-02-03 14:50:51.0
This paper will consider the unique characteristics of the renewable energy and clean-tech sectors and explore how a smartly optimized electronics manufacturing outsourcing model can help OEMs accelerate their timeto- market and support their cost-per-kilowatt reduction goals.
Industry Directory | Consultant / Service Provider / Manufacturer
Criteria Labs is the largest domestic tape & reel service provider with extensive capabilities to address all your tape and reel needs.
Technical Library | 2018-05-23 12:12:43.0
Driven by miniaturization, cost reduction and tighter requirements for electrical and thermal performance, the use of lead-frame based bottom-termination components (LF-BTC) as small-outline no-leads (SON), quad-flat no leads (QFN) packages etc., is increasing. However, a major distractor for the use of such packages in high-reliability applications has been the lack of a visible solder (toe) fillet on the edge surface of the pins: because the post-package assembly singulation process typically leaves bare copper leadframe at the singulation edge, which is not protected against oxidation and thus does not easily solder-wet, a solder fillet (toe fillet) does not generally develop.
Career Center | , India | Engineering,Production
About Product Operations: Product Operations is part of Global Supply Chain Management (Global Manufacturing) and is responsible for New Product Introduction and Product Life Cycle Management from Manufacturing and Supply Operations perspective. The
Industry News | 2008-10-17 11:06:54.0
Lead Free Cost Reduction Collaborators Saturn Electronics Corp., Isola Laminates, and Florida CirTech to Exhibit at SAE Convergence and Mexitronica
ITS is a pure electronics contract manufacturing and assembly company. We offer continuing leadership in both manufacturing technology and process improvement.
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