Industry News | 2016-08-23 16:25:55.0
The SMTA and Chip Scale Review magazine are pleased to announce the Workshops for the 13th Annual International Wafer-Level Packaging Conference (IWLPC). On Thursday, October 20, there will be professional workshops given by instructors who are pre-eminent authorities in their fields. IWLPC will be held October 18-20, 2016 at the DoubleTree Airport Hotel in San Jose, California.
Industry News | 2008-07-16 21:38:29.0
Excerpts taken from the article Will Electronics Follow the Sun? written by Irene Sterian and printed July 1, 2008 in Circuits Assembly Magazine
Industry News | 2009-08-21 23:20:40.0
Minneapolis, MN – The SMTA and MEPTEC are proud to announce the keynote speakers for their co-organized 2009 Medical Electronics Symposium
Industry News | 2011-11-08 15:31:27.0
The SMTA and Chip Scale Review magazine are pleased to announce the 8th Annual International Wafer-Level Packaging Conference and Exhibition was a resounding success.
Industry News | 2013-05-07 18:04:23.0
, IPC — Association Connecting Electronics Industries® will host a one-and-a-half day conference, “Innovations in Electronics in Manufacturing for Medical Devices,” June 12–13 in Minneapolis, Minn.
Industry News | 2017-03-06 12:46:42.0
Nordson ASYMTEK will present a technical paper and poster session at the IMAPS Device Packaging Conference being held at the WeKoPa Resort & Casino in Scottsdale/Fountain Hills, Arizona, March 7-9, 2017.
Industry News | 2024-03-18 11:48:12.0
IPC has announced the expansion of its complimentary training offerings for IPC members with the introduction of a "Foreign Object Debris (FOD) for Electronics Manufacturing" course, now available in French, Spanish and German. This initiative reinforces IPC's commitment to providing valuable resources to its members worldwide. FOD training across electronics manufacturing and assembly can mitigate risks, ensuring quality production and reliable electronics products.
Events Calendar | Wed Mar 07 00:00:00 EST 2018 - Wed Mar 07 00:00:00 EST 2018 | ,
Solder Paste Qualification Testing - SMTA Webinar
Industry News | 2011-03-31 11:54:23.0
Over the past few years, pad cratering has become a vexing problem in lead-free assemblies, largely attributed to problems with the resin used to make a printed board. To help industry eliminate the defect and, at the same time, cut costs, IPC — Association Connecting Electronics Industries® has released IPC-9708, Test Methods for Characterization of PCB Pad Cratering.
Industry News | 2022-12-07 03:45:24.0
X-Ray SMD component Counting machine is also called X-ray SMT Counter, SMT Automatic X-ray counting machine, Intelligent SMT automatic Counter, Automatic X-ray counter etc.