Electronics Forum | Thu Oct 05 13:00:54 EDT 2006 | Mario Scalzo, SMT CPE
Good afternoon! We have a Hand Assembly & Rework Pb-Free RoHS compliant kit available! Please email me offline. Should you have any further questions, please don't hesitate to ask. My contact information is below. Regards, Mario Scalzo, SMT CPE
Electronics Forum | Thu Oct 05 11:59:51 EDT 2006 | Mario Scalzo, SMT CPE
Good afternoon all! Theoretically, there should not be any issues soldering to the SN100C as the tin content of the molten paste alloy should wet to the finish with no problem. I would just ensure that the peak temperature of the joint is above the
Electronics Forum | Thu Jan 07 19:38:12 EST 2021 | ttheis
Hi Deni, I just bought a machine with FJ9 heads- I have never had a flexjet, only regular flex heads. Are there any pointers you can share? What ended up being your problem? When you do a calibration, do you do the CPE also? I have been fortunate
Electronics Forum | Thu Oct 05 12:35:38 EDT 2006 | Mario Scalzo, SMT CPE
Good afternoon! We are able to offer some insight into this and fix your issues. A lot of the time, we are able to offer relief from MCSB using profiling. We have a Technical Paper and Application Note for the elimination of them. They can be fou
Electronics Forum | Thu Oct 05 12:52:34 EDT 2006 | Mario Scalzo, SMT CPE
Good afternoon! Typically, we normally recommend testing the pot, and adding either Sn/Ag or just Sn to keep it at bay. One nice thing about the solubility of Cu in Sn based alloys is that it should reach a theoretical upper limit of about 0.1%. I
Electronics Forum | Thu Oct 05 12:14:15 EDT 2006 | Mario Scalzo, SMT CPE
Good afternoon! We have had great luck with semi-aqueous cleaners from Kyzen and Zestron, and normally recommend both of them. They both have great labs and would gladly offer their input on he cleaning of the flux residue. We make sure that these
Electronics Forum | Thu Oct 05 11:48:00 EDT 2006 | Mario Scalzo, SMT CPE
Good morning all. We are able to offer some insight into the problem and offer a recommended reflow profile to solve this issue, but it really depends on the solder paste that you use, as different manufacturers use different boiling point solvents.
Electronics Forum | Thu Oct 05 11:40:49 EDT 2006 | Mario Scalzo, SMT CPE
David, We have seeing this more and more in the recent weeks. In a nut shell, yes; we believe that the voids that you are seeing are from the trapped air in the via from printing over it. If you could remove the Kapton tape, this might help. Also
Electronics Forum | Thu Oct 05 15:41:36 EDT 2006 | Mario Scalzo, SMT CPE
Good afternoon. From what it sounds like is that the solder joins are not getting hot enough or if it Au, then the increase in the Au content of the joint is increasing the melting point of the final solder joint. To some extent, this will also hap
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