Industry News | 2003-09-25 13:32:47.0
Reduce waste and cost.
Industry News | 2004-04-27 15:19:57.0
Zymet has introduced a new reworkable underfill encapsulant, CN-1453, designed for BGA encapsulation. Removal of defective BGA's is easily accomplished by heating the component and the underfill encapsulant to 220°C. Underfill encapsulant residues are easily scraped or brushed off.
Industry News | 2017-01-24 13:50:40.0
The ProFlow 2K is a dual component dispenser designed for applying small volumes of 2-part adhesives in lines or dots with a high level of control.
Whatsapp 0086 134 2516 4065 Our system accurately meters, mixes and dispenses two-component medium to low-viscosity materials for potting, gasketing,sealing, encapsulation and syringe filling. For variable ratio dispensing, the system handles rati
Whatsapp 0086 134 2516 4065 Our system accurately meters, mixes and dispenses two-component medium to low-viscosity materials for potting, gasketing,sealing, encapsulation and syringe filling. For variable ratio dispensing, the system handles rati
Industry News | 2009-09-17 17:02:12.0
EAST HANOVER, NJ – Zymet has introduced a new reworkable underfill encapsulant, CN-1728, designed to underfill Package-on-Package (POP) assemblies. Underfilled POP’s have greater difficulty in passing thermal cycle tests than underfilled BGA’s. Compared to earlier generation underfills, CN-1728 has a lower coefficient of thermal expansion and higher Tg, and better compatibility with flux residues, both of which contribute to its superior thermal cycle performance.
Industry News | 2012-09-20 13:26:42.0
Electronics assemblers who need to produce prototypes, pre-production boards and other small batch/short-run jobs in-house can now get inline reflow results in a small footprint, at an affordable price-now with full computer control.
Industry News | 2013-02-08 23:26:44.0
Zymet has introduced a new reworkable underfill encapsulant, CN-1751-4, that is extraordinarily crack resistant, to withstand flexing experienced by flexible printed circuitry or drops and shocks of very thin printed circuit assemblies.
Industry News | 2013-04-02 13:04:03.0
Techcon Systems, introduces the new TS9200D Series Jet Tech Valve. The Jet Valve will be available to order effective April 10, 2013
Industry News | 2019-03-31 20:58:34.0
PVA will exhibit at the exhibit at the SMTA Atlanta Expo, scheduled to take place Thursday, April 11, 2019 at the Atlanta Technology Park in Peachtree Corners, GA. Company representatives will discuss PVA’s Jet Coating and Meter-Mix Dispensing System.
