Electronics Forum | Wed Jan 09 01:22:39 EST 2019 | kenneth0
Hi Simond, The baking process is likely to remove any moisture after the cleaning process. We wouldn't want any moisture trapped as this might cause delamination if the package is subject to subsequent heating/reflow process. Hence there's a staging
Electronics Forum | Wed Dec 24 11:49:46 EST 2008 | bandjwet
Put on your thinking caps for this one......We are trying to remove a BGA (10 x 10mm, plastic, 0.8mm pitch) which is approx 3 mm next to another BGA (5 x 5mm, plastic, 0.8mm pitch). The challenge is this second device is underfilled with a softening
Electronics Forum | Tue Jun 09 09:40:47 EDT 1998 | Wolfgang Hantz
| We offer an upgrade service for notebooks with 486 SX/DX CPUs up to 586-133 MHz using the AMD 5x86-133 MHz CPU in the PQFP package. We are pretty succesful with this service and until today we did more than 1000 notebook upgrades this way. | Now,
Electronics Forum | Wed Jun 10 14:22:07 EDT 1998 | Chrys
| | We offer an upgrade service for notebooks with 486 SX/DX CPUs up to 586-133 MHz using the AMD 5x86-133 MHz CPU in the PQFP package. We are pretty succesful with this service and until today we did more than 1000 notebook upgrades this way. | | N
Electronics Forum | Thu Feb 13 09:35:35 EST 2020 | jactomas
Since 6 days we are tryng to solve a issue in our MyData12. For some reason, the TpSys doesn´t start properly and continuesly is rebooting after a message "MMI exited, status = 134, terminating servers - Waiting for Tpsys to finish - MMI returned 13
Electronics Forum | Wed Jul 12 17:05:22 EDT 2017 | rodrigo
Hi all, Our Fuji cp6 woke up with a bad power supply (ps) this morning. The ps is one of two 24vdc (Corsel P300E-24). There is one inside the cabinet and one on the door where the cpu card is. The bad one is the one inside the cabinet. So we had anot
Electronics Forum | Thu Nov 19 16:24:23 EST 1998 | Earl Moon
| Hello Everybody | | I am new to the electronics packaging arena, please be patient with me... I have a few questions regarding the various passivation used on the silicon dice. I would really appreciate if you guys could provide me with more info
Electronics Forum | Wed Jun 24 21:32:07 EDT 1998 | Jon Medernach
Sorry Earl but as Superboy's dad I believe that makes me Superman as we did not remove him from the wreckage of a spacecraft. There is quite a bit involved in the FC process. The Kyushu Matsushita Electric Research Labs has been developing Flip Chi
Electronics Forum | Thu Jun 25 08:24:13 EDT 1998 | Earl Moon
| Sorry Earl but as Superboy's dad I believe that makes me Superman as we did not remove him from the wreckage of a spacecraft. There is quite a bit involved in the FC process. The Kyushu Matsushita Electric Research Labs has been developing Flip C
Electronics Forum | Thu Jun 25 09:08:14 EDT 1998 | Russ Miculich
Thought I'd jump in as I helped develop materials for the FC game. Au/Pb - bumping - talk to Hughes Tuscon about this. They do it and will discuss the process. For Flip Chip Technology here in the States - contact Peter Elenius at Flip Chip Techno
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