Parts & Supplies | General Purpose Equipment
DEK 265 CPU Card J321 V1 16 SN 140069 Used, good condition, removed from a working system.
Parts & Supplies | General Purpose Equipment
Fuji/Sharp VM 1110TA CPU Board X0009PA-2 SN: 8V1T2341 Used, Good condition, removed from a known working system.
Parts & Supplies | General Purpose Equipment
Fuji/Sharp VM1152A CPU Control Board X0016PA-4 SN: 1V15523485 Used, Good condition, removed from a known working system
Parts & Supplies | General Purpose Equipment
Fuji VM1160B CPU Board X0016PA-4/X0020PA-4 Used, good condition removed from a known working system.
http://yincae.com/index.html YINCAE SMT 256 Dipping Process YINCAE SMT 266 Jetting Process
SMT256EP solderable adhesive is self-leveling and self-soldering adhesives, which has been designed for high temperature Pb-free application. By comparison with conductive adhesives (Ag), SMT256EP solderable adhesive has higher stable electrical and
Industry News | 2009-09-17 17:02:12.0
EAST HANOVER, NJ – Zymet has introduced a new reworkable underfill encapsulant, CN-1728, designed to underfill Package-on-Package (POP) assemblies. Underfilled POP’s have greater difficulty in passing thermal cycle tests than underfilled BGA’s. Compared to earlier generation underfills, CN-1728 has a lower coefficient of thermal expansion and higher Tg, and better compatibility with flux residues, both of which contribute to its superior thermal cycle performance.
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Parts & Supplies | Pick and Place/Feeders
Removed from a working Juki KE-2010 SMT Machine. Used, as pictured. FOB: Origin, MN USA Additional Juki KE2010 and Juki solder paste screen printer parts available from Assured Technical Service LLC Assured Technical Service LLC AssuredTechnica
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Parts & Supplies | Pick and Place/Feeders
Removed from a working Juki KE-2010 SMT Pick and Place Machine. Used, as pictured. FOB: Origin, MN USA * Contact us for expedited shipping services * Contact us for shipping options Additional Juki KE-2010L SMT Pick and Place and Juki KS1700 Sol
Industry News | 2004-04-27 15:19:57.0
Zymet has introduced a new reworkable underfill encapsulant, CN-1453, designed for BGA encapsulation. Removal of defective BGA's is easily accomplished by heating the component and the underfill encapsulant to 220°C. Underfill encapsulant residues are easily scraped or brushed off.
