Parts & Supplies | General Purpose Equipment
Fuji/Sharp VM1152A CPU Control Board X0016PA-4 SN: 1V15523485 Used, Good condition, removed from a known working system
Parts & Supplies | General Purpose Equipment
Fuji VM1160B CPU Board X0016PA-4/X0020PA-4 Used, good condition removed from a known working system.
http://yincae.com/index.html YINCAE SMT 256 Dipping Process YINCAE SMT 266 Jetting Process
SMT256EP solderable adhesive is self-leveling and self-soldering adhesives, which has been designed for high temperature Pb-free application. By comparison with conductive adhesives (Ag), SMT256EP solderable adhesive has higher stable electrical and
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Parts & Supplies | Pick and Place/Feeders
Removed from a working Juki KE-2010 SMT Machine. Used, as pictured. FOB: Origin, MN USA Additional Juki KE2010 and Juki solder paste screen printer parts available from Assured Technical Service LLC Assured Technical Service LLC AssuredTechnica
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Parts & Supplies | Pick and Place/Feeders
Removed from a working Juki KE-2010 SMT Pick and Place Machine. Used, as pictured. FOB: Origin, MN USA * Contact us for expedited shipping services * Contact us for shipping options Additional Juki KE-2010L SMT Pick and Place and Juki KS1700 Sol
Industry News | 2009-09-17 17:02:12.0
EAST HANOVER, NJ – Zymet has introduced a new reworkable underfill encapsulant, CN-1728, designed to underfill Package-on-Package (POP) assemblies. Underfilled POP’s have greater difficulty in passing thermal cycle tests than underfilled BGA’s. Compared to earlier generation underfills, CN-1728 has a lower coefficient of thermal expansion and higher Tg, and better compatibility with flux residues, both of which contribute to its superior thermal cycle performance.
Industry News | 2004-04-27 15:19:57.0
Zymet has introduced a new reworkable underfill encapsulant, CN-1453, designed for BGA encapsulation. Removal of defective BGA's is easily accomplished by heating the component and the underfill encapsulant to 220°C. Underfill encapsulant residues are easily scraped or brushed off.
Technical Library | 2013-12-05 17:09:03.0
The functionality of electronic devices continues to increase at an extraordinary rate. Simultaneously consumers are expecting even more and in ever smaller packages. One enabler for shrinking electronics has been the flexible circuit board that allows the circuit board to fit a wide variety of shapes. Flexible printed circuits (FPC) have the capability to be very thin and can have unpackaged components directly attached using surface mount technology (SMT) and flip chip on flex technologies. Bare die can also be thinned and attached very close to the circuit board. However one caveat of high density flexible circuit boards with thin die is that they can be very fragile. The use of back side films and underfill can protect the die making circuits more robust. For underfill to work well it requires good adhesion to the circuit board which can mean that flux residues under the die normally must be removed prior to underfilling.
World's First Solder Joint Encapsulant Perfect solution for customers looking to eliminate underfilling processes. The SMT 256 Individual Solder Joint Encapsulation Adhesive is the world’s first combined flux gel/individual solder joint encapsulati
