Industry News | 2016-02-29 09:18:03.0
Inventec introduces new enhanced co-solvent, Topklean EL20P for challenging refluxing applications, To learn more about Topklean EL20P you can visit Inventec at IPC Apex exhibition, booth 1863.
Industry News | 2016-09-15 18:20:55.0
KYZEN is pleased to announce plans to exhibit and present during the conferences at IEMT-EMAP 2016, scheduled to take place Sept. 20-22, at the G-Hotel in Penang, Malaysia. KYZEN Sdn Bhd’s Technical Sales Manager, TC Loy, will present the paper authored by Mike Bixenman, MBA, DBA and Jason Chan, entitled, “Advanced Packaging and Electronic Assembly Cleaning Fluid Innovation.”
Industry News | 2016-09-16 15:53:13.0
KYZEN is pleased to announce that it will exhibit and present at the SMTA Penang Vendor Show, scheduled to take place Sept. 23, 2016 at the Eastin Hotel Penang. T.C. Loy, KYZEN Sdn Bhd’s Technical Sales Manager, will present the paper authored by Mike Bixenman, MBA, DBA and Jason Chan, entitled, “Advanced Packaging and Electronic Assembly Cleaning Fluid Innovation.”
Industry News | 2005-01-19 10:22:26.0
Indium Corporation of America recently awarded their annual Silver Quill Award for excellence in technical writing to two employees.
Industry News | 2008-08-26 17:36:37.0
Richardson, TX (August 26, 2008) ASSET� InterTech (www.asset-intertech.com), the leading supplier of open tools for embedded instrumentation, recently became a founding member of the International Electronics Manufacturing Initiative's (iNEMI) boundary scan adoption project. iNEMI, which is an electronics industry consortium of over 70 manufacturers, suppliers and related organizations, has undertaken an effort to encourage greater adoption of the IEEE 1149.1 boundary scan standard (commonly known as JTAG, after the Joint Test Action Group which defined the original specification).
Industry News | 2016-03-31 14:44:00.0
ADLINK Technology today announced new COM Express® computer-on-modules (COMs) based on the 6th generation Intel® Core™ i7/i5/i3 processors and latest Xeon® processors. These new modules follow the form, fit, function design principal for optimum flexibility in upgrading and application scalability, enabling accelerated development and faster time-to-market for embedded applications.
Industry News | 2008-03-20 16:08:23.0
LITTLETON, MASS. - VJ Electronix, the leader in X-Ray inspection technology and Rework systems, announces that it will exhibit the Summit 1800A advanced rework system in booth 648 at the upcoming IPC APEX exhibition and designers summit, scheduled to take place April 1-3, 2008, in Las Vegas, NV
Industry News | 2016-10-11 19:03:14.0
Nordson MARCH received the 2016 Global Technology Award for its FlexTRAK®-CDS high-volume plasma system at a ceremony held in conjunction with the SMTA International conference in Rosemont, IL on September 27, 2016. The system removes contamination, etches surfaces to improve adhesion, and provides surface activation prior to die attach, wire bond, mold encapsulation, and underfill to lead frame strips, laminated substrates, and other strip-type electronic components.
Industry News | 2010-07-16 14:59:02.0
Indium Corporation’s Vice President of Technology, Dr. Ning-Cheng Lee, was recognized with the IEEE’s Components, Packaging, and Manufacturing Technology Society (CPMT) Electronics Manufacturing Technology Award in acknowledgement of his contributions to electronics manufacturing technology.
Industry News | 2015-05-13 14:00:03.0
The evolution of soldering processes in the Microelectronics Industry has made a paradigm shift away from Sn/ Pb to Pb-free. Compounded with advancements in miniaturization, Pb- free soldering's higher re-flow temperature and the nature of solder has resulted in poor reliability relative to: mechanical strength of the solder joint, warpage and thermal cycling performance. In response, YINCAE engineered low temperature solder joint encapsulation adhesives.
.gif)
.png)
