Precision Dispensing System for Heated Dispense Applications The GPD Global MAX II is a compact; high-accuracy system designed for today’s advanced heated dispensing applications. The frame is molded from “liquid rock” which gives the system a stabl
New Equipment | Rework & Repair Services
BEST Inc and its subject matter experts to help you diagnos, troubleshoot and develop your PCB rework processes. Our PCB consulting services have assisted OEMs, contract manufacturers and repair centers develop repeatable processes for the rework and
Used SMT Equipment | Board Cleaners
Automatic Wash + Rinse + Cleanliness Test + Dry + SPC Lead Free Ready The SMT Series Cleaning Systems include the industry's most powerful batch-format drying system. The SMT series cleaners utilize a combination of convection and radiant heat t
Used SMT Equipment | In-Circuit Testers
Agilent N9020A Standards evolve, product cycles get shorter, and each project demands tradeoffs and decisions about specs and capabilities, about throughput and yield. A highly flexible signal analyzer helps you make solid choices and keep things
Industry News | 2017-03-31 12:29:11.0
BEST installs and brings Up mass rework machine capability to reduce costs and increase the turnover of boards requiring lots of parts change outs.
Industry News | 2003-03-27 08:15:33.0
Modular Embedded Circuit Board from parvus Enables Local Device Fingerprint Biometrics
Technical Library | 2013-12-05 17:09:03.0
The functionality of electronic devices continues to increase at an extraordinary rate. Simultaneously consumers are expecting even more and in ever smaller packages. One enabler for shrinking electronics has been the flexible circuit board that allows the circuit board to fit a wide variety of shapes. Flexible printed circuits (FPC) have the capability to be very thin and can have unpackaged components directly attached using surface mount technology (SMT) and flip chip on flex technologies. Bare die can also be thinned and attached very close to the circuit board. However one caveat of high density flexible circuit boards with thin die is that they can be very fragile. The use of back side films and underfill can protect the die making circuits more robust. For underfill to work well it requires good adhesion to the circuit board which can mean that flux residues under the die normally must be removed prior to underfilling.
Precision Dispensing System for Heated Dispense Applications The GPD Global MAX II is a compact; high-accuracy system designed for today’s advanced heated dispensing applications. The frame is molded from “liquid rock” which gives the system a stabl
GPD Global | https://www.gpd-global.com/pdf/doc/CPU-Board-Upgrade-Procedure-22240102.pdf
2 CPU Board Upgrade Procedure 1 - Replace CPU board 5. After completely disconnecting the existing CPU board (PN 2025-0064), remove it from the computer
Heller Industries Inc. | https://hellerindustries.com/fluxless-soldering/
. Flux helps to remove oxides from the metals being solder, improving the overall wettability of solder needed for high quality solder joints
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