Thermodime� diamond heat transfer compound from Electrospell is an ultra high thermal conductivity thermal interface material composed of pure surface-modified diamond microcrystals suspended in a special carrier fluid. The product comes in a 1 ml sy
The Viscom S3088 CCI checks for the completeness of conformal coating on PCBs, and is intelligently linked to other inspection gates from Viscom. Reliable, precise detection of coating voids. Transparent conformal coating protects electronics assem
Electronics Forum | Thu Dec 07 10:10:49 EST 2006 | Learn from U
Hello, I need your advice..Welcome any input!! Cheers..
Electronics Forum | Thu Dec 07 14:23:30 EST 2006 | russ
I wuld say it is attachment method and post install force that is the problem not the size of the heatsink. we place heatsinks that are at least 5 times the size of BGA with no issue, they are attached with very precision torque drivers. Russ
Used SMT Equipment | Turnkey Lines
Functional Pre-Owned Complete SMT Assembly Line - Still Operational (Subject to prior sell, I am listing this on other venues) Up for sale is a full turnkey SMT line and all of it's accessories, of which there are a lot, fe
Industry News | 2024-04-29 03:28:04.0
In the dynamic world of Surface Mount Technology (SMT), precision and efficiency are paramount. Manufacturers worldwide seek inspection solutions that enhance accuracy and streamline production processes. Enter SMT AOI AI Inspection Technology – an innovative solution that combines cutting-edge artificial intelligence algorithms with advanced inspection capabilities.
Industry News | 2023-01-16 07:35:11.0
The best technical conference papers of IPC APEX EXPO 2023 have been selected. Voted on through a ballot process by members of the IPC APEX EXPO Technical Program Committee (TPC), the paper authors will be recognized during show opening remarks on Tuesday, January 24.
Parts & Supplies | Soldering - Wave
Controller and interface assembly from an ERSA wave solder machine EPROM V2.97 KUHNKE 71.633. 425.120.01 The glass is cracked but the LCD is not cracked. FOB: Origin AssuredTechnicalServiceLLC@Gmail.com
Technical Library | 2024-09-02 17:31:09.0
The cracking and delamination of printed circuit boards (PCB) during exposure to elevated thermal exposure, such as reflow and rework, have always been a concern for the electronics industry. However, with the increasing spread of Pb-free assembly into industries with lower volume and higher complexity, the occurrence of these events is increasing in frequency. Several telecom and enterprise original equipment manufacturers (OEMs) have reported that the robustness of their PCBs is their number one concern during the transition from SnPb to Pb-free product. Cracking and delamination within PCBs can be cohesive or adhesive in nature and can occur within the weave, along the weave, or at the copper/epoxy interface (see Figure 1). The particular role of moisture absorption and other PCB material properties, such as out of plane expansion on this phenomenon is still being debated.
Technical Library | 2019-05-01 23:18:27.0
Moisture can accelerate various failure mechanisms in printed circuit board assemblies. Moisture can be initially present in the epoxy glass prepreg, absorbed during the wet processes in printed circuit board manufacturing, or diffuse into the printed circuit board during storage. Moisture can reside in the resin, resin/glass interfaces, and micro-cracks or voids due to defects. Higher reflow temperatures associated with lead-free processing increase the vapor pressure, which can lead to higher amounts of moisture uptake compared to eutectic tin-lead reflow processes. In addition to cohesive or adhesive failures within the printed circuit board that lead to cracking and delamination, moisture can also lead to the creation of low impedance paths due to metal migration, interfacial degradation resulting in conductive filament formation, and changes in dimensional stability. Studies have shown that moisture can also reduce the glass-transition temperature and increase the dielectric constant, leading to a reduction in circuit switching speeds and an increase in propagation delay times. This paper provides an overview of printed circuit board fabrication, followed by a brief discussion of moisture diffusion processes, governing models, and dependent variables. We then present guidelines for printed circuit board handling and storage during various stages of production and fabrication so as to mitigate moisture-induced failures.
Features: 1. Desktop single table router speed 500mm / s. 2. High-quality shaft system allows the system to quickly increase and decrease, reduce the same period of time, improve productivity, while maintaining high accuracy. 3. Use high-quality ha
Sales:Peter Chen Email:s1@hk-yush.com Whatsapp/Tel:+86 13580833864 Product description: YSV-3A is a fully automatic round blades moving depneling mac
Career Center | Fayetteville, Arkansas USA | Engineering,Production
I enjoyed working in Electronics Manufacturing while in college (BSEE) and would like to pursue an engineering job in a related field.
Career Center | , District of Columbia | Engineering,Management,Production,Sales/Marketing
• Strong technical leadership and decision-making skills; strong verbal and written communication skills to provide clear, crisp direction for key issue resolution; and good team skills to facilitate cross-functional cross -site team effectiveness.
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
Solder crack path typically found at solder joint / BGA package interface BGAs with 50% of their solder joints containing voids in the 35-60