Industry Directory: crack ceramic substrate (29)

OCTO by CERcuits - Online Ceramic PCB

Industry Directory | Manufacturer

OCTO, powered by CERcuits, provides ceramic PCB & substrates to the electronics industry. We develop and manufacture alumina PCB, aluminum nitride PCB, heat plates and other substrates. Get quotes & order online at our OCTO portal

Thick Film Solutions Inc

Industry Directory | Manufacturer

Manufacturer of thick film substrates (electronic circuits on ceramics).

New SMT Equipment: crack ceramic substrate (32)

Aluminum PCB; Metal Core PCB; LED PCB Circuit board -- Hitech Circuits Co., Limited

Aluminum PCB; Metal Core PCB; LED PCB Circuit board -- Hitech Circuits Co., Limited

New Equipment | Fabrication Services

Aluminum PCB & Metal Core PCB & LED PCB Circuit board Aluminium PCB are metal-based, copper-clad laminates with a good heat dissipation function. Usually, Aluminium PCB is refer to LED PCB board, which is the most important part of LED display and l

Hitech Circuits Co., Limited

ASM/Siemens Siplace Ceramic Nozzles

ASM/Siemens Siplace Ceramic Nozzles

New Equipment | Pick & Place

These new ceramic versions are available in the 901, 902, 904, 906, & 925 versions. Special vacuum geometry provides excellent performance in the machine which saves you time and money during production. The machined bodies are flexible, so that they

Count On Tools, Inc.

Electronics Forum: crack ceramic substrate (288)

SMT on ceramic substrate

Electronics Forum | Mon Aug 27 10:09:50 EDT 2001 | gresko

Steve, Depending on the type of equipment you are using for P&P you may want to consider placing and processing the substrates in Auer boats. I have provided many applications for ceramic substarate users using purchased Auer boats or machined palle

SMT on ceramic substrate

Electronics Forum | Wed Aug 22 21:00:41 EDT 2001 | dlkearns1

Yes, it is very true and very clean SNAP!

Used SMT Equipment: crack ceramic substrate (17)

Panasonic  high speed chip mounter CM602-L

Panasonic high speed chip mounter CM602-L

Used SMT Equipment | SMT Equipment

Product Name:Panasoinc  high speed chip mounter CM602-L Product number: CM602-L Detailed product introduction Substrate size: L50 mm x W50 mm ~L510 mm W460 mm x High speed mounting head: 12 suction nozzle (ceramic) (white) Mounting speed: 0.036

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Panasonic  high speed chip mounter CM602-L

Panasonic high speed chip mounter CM602-L

Used SMT Equipment | SMT Equipment

Product Name:Panasoinc  high speed chip mounter CM602-L Product number: CM602-L Detailed product introduction Substrate size: L50 mm x W50 mm ~L510 mm W460 mm x High speed mounting head: 12 suction nozzle (ceramic) (white) Mounting speed: 0.036

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Industry News: crack ceramic substrate (88)

Printed Circuit Board (PCB) for Surface Mount Technology (SMT)

Industry News | 2018-12-08 03:27:35.0

Printed Circuit Board (PCB) for Surface Mount Technology (SMT)

Flason Electronic Co.,limited

Count On Tools’ Innovative Siemens Ceramic Nozzles Outperform and Outlast

Industry News | 2010-08-17 11:50:19.0

Count On Tools Inc., a leading provider of precision components and SMT spare parts, introduces its newly redesigned series of Siemens ceramic replacement nozzles.

Count On Tools, Inc.

Parts & Supplies: crack ceramic substrate (29)

Siemens 901, 902, 904, 906, 925 ESD Ceramic Nozzles (Siplace, S20,)

Siemens 901, 902, 904, 906, 925 ESD Ceramic Nozzles (Siplace, S20,)

Parts & Supplies | Pick and Place/Feeders

The new series of Siemens ESD ceramic replacement nozzles are revolutionizing the pick and place industry by offering more efficiency and outlasting all competitors' nozzles, even OEM! Special vacuum geometry provides excellent performance in the mac

Count On Tools, Inc.

Siemens BOARD 00383748-C5

Siemens BOARD 00383748-C5

Parts & Supplies | SMT Equipment

00357288-01 FUSE 5x20 10A WITH DELAY 00357289-01 FUSE 5x20 / T 1,6A / Glas 00357328-01 BACKPLANE KSP-SYSS23 00357744S01 Adapter e156 00357795S01 PNEUMATIC-SERVICING-UNIT 00357871-01 SOCKET PROTECTION TEDDY 6310 WHITE 00357969-02 Velcro Tape for

Qinyi Electronics Co.,Ltd

Technical Library: crack ceramic substrate (15)

Underfill Dispensing For Aerospace Military And Defense

Technical Library | 2023-08-16 18:20:44.0

One of our defense customers planned to dispense underfill material for small and large die, using Hysol FP4545FC epoxy encapsulant. This process dissipates stress on solder joints and prevents cracking and fracturing between the bottom of the die and the surface of the substrate.

GPD Global

Anisotropic grain growth and crack propagation in eutectic microstructure under cyclic temperature annealing in flip-chip SnPb composite solder joints

Technical Library | 2014-06-19 18:13:23.0

For high-density electronic packaging,the application of flip-chip solder joints has been well received in the microelectronics industry. High-lead(Pb) solders such as Sn5Pb95 are presently granted immunity from the RoHS requirements for their use in high-end flip-chip devices, especially in military applications. In flip-chip technology for consumer electronic products, organic substrates have replaced ceramic substrates due to the demand for less weight and low cost. However, the liquidus temperatures of high-Pb solders are over 300°C which would damage organic substrates during reflow because of the low glass transition temperature. To overcome this difficulty, the composite solder approach was developed...

National Chiao Tung University

Videos: crack ceramic substrate (41)

Siemens BOARD 00383748-C5

Videos

00357288-01 FUSE 5x20 10A WITH DELAY 00357289-01 FUSE 5x20 / T 1,6A / Glas 00357328-01 BACKPLANE KSP-SYSS23 00357744S01 Adapter e156 00357795S01 PNEUMATIC-SERVICING-UNIT 00357871-01 SOCKET PROTECTION TEDDY 6310 WHITE 00357969-02 Velcro Tape for

Qinyi Electronics Co.,Ltd

manual pcb separator

manual pcb separator

Videos

Manual V Cut PCB Depanelizer PCB Board Cutter It is widely used in modern rigid PCB industry. Manual V Cut PCB Depanelizer Machine Features: 1. Simple operation, speed is fast, to ensure that components of substrate are not injured by the move

Winsmart Electronic Co.,Ltd

Events Calendar: crack ceramic substrate (1)

BGA & Area Array Failures, Causes & Corrective Actions Online Webinar

Events Calendar | Mon Mar 16 00:00:00 EDT 2020 - Mon Mar 16 00:00:00 EDT 2020 | ,

BGA & Area Array Failures, Causes & Corrective Actions Online Webinar

Surface Mount Technology Association (SMTA)

Career Center - Jobs: crack ceramic substrate (1)

Senior RF Circuits Design Engineer

Career Center | Brooklyn, New York USA | Engineering,Management

Mini-Circuits designs, manufactures and distributes integrated circuits, modules, and sub-systems for high performance radio frequency (RF) and microwave applications.  With design, sales and manufacturing locations in over 30 countries, Mini-Ci

Mini-Circuits

Career Center - Resumes: crack ceramic substrate (1)

resume

Career Center | , District of Columbia | Engineering,Management,Production,Sales/Marketing

• Strong technical leadership and decision-making skills; strong verbal and written communication skills to provide clear, crisp direction for key issue resolution; and good team skills to facilitate cross-functional cross -site team effectiveness.

Express Newsletter: crack ceramic substrate (212)

SMTnet Express - June 19, 2014

SMTnet Express, June 19, 2014, Subscribers: 22851, Members: Companies: 13906, Users: 36363 Anisotropic grain growth and crack propagation in eutectic microstructure under cyclic temperature annealing in flip-chip SnPb composite solder joints Y

Partner Websites: crack ceramic substrate (95)

Which PCB Substrate Should I Use? | Imagineering, Inc.

Imagineering, Inc. | https://www.pcbnet.com/blog/pcb-substrate/

Which PCB Substrate Should I Use? | Imagineering, Inc. Skip to main content Resources Support Contact Us FAQs Live Chat My Account 847-806-0003 Menu PCB Capabilities Fabrication Technology Roadmap Materials Available HDI Tolerances Certifications

Imagineering, Inc.

SolderTips: Problems With Stress Cracks in Ceramic Components | EPTAC

| https://www.eptac.com/soldertips/problems-with-stress-cracks-in-ceramic-components/

. Although it may not be seen at this time, the ceramic will fracture when exposed to heat cycles. Solder paste, Tin/Lead or Lead-Free. Lead-Free is more brittle and the stress relief will be absorbed by the component causing it to crack


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