A Sustainable Alternative - Humitector cards are halogen-free and cobalt dichloride free. Visit https://www.clariant.com/solutions/products/2017/10/31/00/12/humitector-type-2-nonreversible-humidity-indicator-card?utm_source=CLRYouTube&utm_medium=Vi
Industry News | 2010-08-04 21:04:22.0
Manufacturing reliable and sustainable electronics that meet customer needs without failure during the product’s life cycle has been stymied by myriad challenges, from environmental regulations to new materials and processes. Bringing together the latest research by industry experts, IPC — Association Connecting Electronics Industries® will host a Technical Conference on Electronics Sustainability, September 28–30 at Electronics Midwest, in Rosemont, Ill. Electronics Midwest is produced jointly by IPC and Canon Communications.
Industry News | 2024-04-29 03:28:04.0
In the dynamic world of Surface Mount Technology (SMT), precision and efficiency are paramount. Manufacturers worldwide seek inspection solutions that enhance accuracy and streamline production processes. Enter SMT AOI AI Inspection Technology – an innovative solution that combines cutting-edge artificial intelligence algorithms with advanced inspection capabilities.
Industry News | 2019-10-22 12:34:34.0
Humitector™ Type 2 delivers advanced sustainable attributes including halogen-free*, cobalt dichloride-free, and reduced cobalt dibromide content The use of Type 2 Humidity Indicator Cards with a non-reversible 60% RH spot indicator is preferred by IPC/JEDEC standard J-STD-033D.
Technical Library | 2014-06-19 18:13:23.0
For high-density electronic packaging,the application of flip-chip solder joints has been well received in the microelectronics industry. High-lead(Pb) solders such as Sn5Pb95 are presently granted immunity from the RoHS requirements for their use in high-end flip-chip devices, especially in military applications. In flip-chip technology for consumer electronic products, organic substrates have replaced ceramic substrates due to the demand for less weight and low cost. However, the liquidus temperatures of high-Pb solders are over 300°C which would damage organic substrates during reflow because of the low glass transition temperature. To overcome this difficulty, the composite solder approach was developed...
World's First Solder Joint Encapsulant Perfect solution for customers looking to eliminate underfilling processes. The SMT 256 Individual Solder Joint Encapsulation Adhesive is the world’s first combined flux gel/individual solder joint encapsulati
Industry News | 2023-11-29 08:23:40.0
Causes of Cracking of Stainless Steel Welded Tube
Industry News | 2017-01-05 04:27:37.0
BGA Inspection & Defect Photo Album (Can be downloaded) The photo CD-ROM album featuring over 280 colour images on BGA, materials, inspection and defects and is available to allow engineers to create their own training material, PowerPoint files, process documents, technical articles and standards. The disk includes examples of the following:
http://yincae.com/index.html YINCAE SMT 256 Dipping Process YINCAE SMT 266 Jetting Process
