SMT266 offers all the features and advantages of our SMT256 series, in a convenient jetting adhesive form (and can also be brushed on during rework). SMT 266 series spray adhesives have been designed to enhance solder joint reliability and eliminat
Industry News | 2017-01-05 04:27:37.0
BGA Inspection & Defect Photo Album (Can be downloaded) The photo CD-ROM album featuring over 280 colour images on BGA, materials, inspection and defects and is available to allow engineers to create their own training material, PowerPoint files, process documents, technical articles and standards. The disk includes examples of the following:
http://yincae.com/index.html YINCAE SMT 256 Dipping Process YINCAE SMT 266 Jetting Process
New Equipment | Rework & Repair Equipment
The need to reduce PV manufacturing costs combined with the present shortage of polysilicon feedstock are driving a steady reduction in wafer and cell thicknesses. The PS-900-Solar Soldering System is the perfect solution Soldering of wires (tabs and
Technical Library | 2015-02-19 16:54:34.0
Pad cratering is an important failure mode besides crack of solder joint as it’ll pass the regular test but have impact on the long term reliability of the product. A new pin pull test method with solder ball attached and positioning the test board at an angle of 30º is employed to study the strength of pad cratering. This new method clearly reveals the failure mechanism. And a proper way to interpret the finite element analysis (FEA) result is discussed. Impact of pad dimension, width and angle of copper trace on the strength is included. Some findings not included in previous research could help to guide the design for better performance
Industry News | 2010-09-16 21:44:04.0
The Balver Zinn Group announces that Cobar Europe BV now distributes Yincae Advanced Materials’ SMT 158 Capillary Underfill and SMT 256 Individual Solder Joint Encapsulations throughout Europe.
Industry Directory | Manufacturer
Shuttle Star Technology designs and builds advanced off-line 2.5D&3D x-ray inspection systems for solder joint and final assembly test inspection in SMT&EMS. It uses world-class X-ray techniques with advanced defect detection.
Aluminium pcb depaneling machine http://www.vcutpcbdepaneling.com Email?sales@yushunli.com evaliu@yushunli.com Website?http://www.hk-yush.com /http://www.pcbdepanelingmachine.com http://www.vcutpcbdepaneling.com / http://www.yushunli.com / http://www
Technical Library | 2014-10-30 01:48:43.0
The ultimate life of a microelectronics component is often limited by failure of a solder joint due to crack growth through the laminate under a contact pad (cratering), through the intermetallic bond to the pad, or through the solder itself. Whatever the failure mode proper assessments or even relative comparisons of life in service are not possible based on accelerated testing with fixed amplitudes, or random vibration testing, alone. Effects of thermal cycling enhanced precipitate coarsening on the deformation properties can be accounted for by microstructurally adaptive constitutive relations, but separate effects on the rate of recrystallization lead to a break-down in common damage accumulation laws such as Miner's rule. Isothermal cycling of individual solder joints revealed additional effects of amplitude variations on the deformation properties that cannot currently be accounted for directly. We propose a practical modification to Miner's rule for solder failure to circumvent this problem. Testing of individual solder pads, eliminating effects of the solder properties, still showed variations in cycling amplitude to systematically reduce subsequent acceleration factors for solder pad cratering. General trends, anticipated consequences and remaining research needs are discussed
Industry News | 2010-03-03 14:29:02.0
OK International (www.okinternational.com) has launched a new soldering system for PV tabbing and bussing applications proven to reduce micro cracking. The PS900 with specially designed hoof tip geometry optimizes the power delivered to the solder joint while it’s temperature-sensitive heater ensures low temperature soldering thus minimizing thermally induced stresses on cell surfaces.
