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Your Guide to Process Defect of the Month

Industry News | 2016-08-19 05:00:52.0

If you have a process problem, let NPL Defect of the Month Video help you team

ASKbobwillis.com

SHENMAO Technology will attend AutoTronics Taipei 2018

Industry News | 2018-04-05 17:27:40.0

SHENMAO America today announced plans to exhibit in Booth L1101 at AutoTronics Taipei 2018, scheduled to take place April 11-14 at the Nangang Exhibition Center. The company’s new PF610-P250 solder paste, PF606-F101 solder wire and SMCW-3 cleaner are designed for automotive applications.

Shenmao Technology Inc.

Christian Ott of SEHO Systems to Offer Void Reduction Tips at SMTA International

Industry News | 2012-09-17 15:38:30.0

SEHO North America, Inc. announces that Christian Ott, Senior Sales and Project Manager, will present a paper titled “Reduction of Voids in Solder Joints …

SEHO Systems GmbH

Fatigue Damage Behavior of a Surface-mount Electronic Package Under Different Cyclic Applied Loads.

Technical Library | 2014-07-10 17:37:18.0

This paper studies and compares the effects of pull–pull and 3-point bending cyclic loadings on the mechanical fatigue damage behaviors of a solder joint in a surface-mount electronic package.The comparisons are based on experimental investigations using scanning electron microscopy (SEM) in-situ technology and nonlinear finite element modeling, respectively. The compared results indicate that there are different threshold levels of plastic strain for the initial damage of solder joints under two cyclic applied loads; meanwhile, fatigue crack initiation occurs at different locations, and the accumulation of equivalent plastic strain determines the trend and direction of fatigue crack propagation. In addition, simulation results of the fatigue damage process of solder joints considering a constitutive model of damage initiation criteria for ductile materials and damage evolution based on accumulating inelastic hysteresis energy are identical to the experimental results. The actual fatigue life of the solder joint is almost the same and demonstrates that the FE modeling used in this study can provide an accurate prediction of solder joint fatigue failure.

Tsinghua University

Indium Corporation Expert to Present on Low-Temperature Solder Paste at SMTA Empire Expo

Industry News | 2023-09-25 17:55:00.0

Indium Corporation R&D Manager, Alloy Group and Principal Research Metallurgist Dr. HongWen Zhang will present at the SMTA Empire Expo & Tech Forum on September 26 in Syracuse, NY. Also at the conference, Regional Sales Manager Emily Belfield will host a panel discussion, Generational Differences in Today's Workplace.

Indium Corporation

Multiple Groups Of Blades PCB Depaneling YSVJ-650 Machine PCB Depaneling Cutter

Multiple Groups Of Blades PCB Depaneling YSVJ-650 Machine PCB Depaneling Cutter

Videos

High quality PCB depaneling machine / V-cut PCB depanelizer,multi-blade depaneling machine,Pcb Separator Feature 1. The shaft of the knives( top and bottom) is design to be an an integral whole, it is convenient to install, pick and place. 2.T

YUSH Electronic Technology Co.,Ltd

Gen3 Systems Sponsors IPC Europe High-Reliability Forum

Industry News | 2014-10-01 19:42:59.0

Gen3 Systems Limited sponsors the IPC Europe High-Reliability Forum, scheduled to take place Oct. 14-15, 2014 in Düsseldorf, Germany.

Gen3 Systems

Thermaltronics Introduces New Line of Soldering Tips

Industry News | 2019-06-09 19:16:34.0

Thermaltronics USA including the award-winning TMT-9800S soldering robot, announces the development and introduction of a new range of new soldering tips designed specifically for difficult soldering applications.

Thermaltronics USA, Inc.

Effect Of Voids On Thermo-Mechanical Reliability of Solder Joints

Technical Library | 2019-10-16 23:18:15.0

Despite being a continuous subject of discussion, the existence of voids and their effect on solder joint reliability has always been controversial. In this work we revisit previous works on the various types of voids, their origins and their effect on thermo-mechanical properties of solder joints. We focus on macro voids, intermetallics micro voids, and shrinkage voids, which result from solder paste and alloy characteristics. We compare results from the literature to our own experimental data, and use fatigue-crack initiation and propagation theory to support our findings. Through a series of examples, we show that size and location of macro voids are not the primary factor affecting solder joint mechanical and thermal fatigue life. Indeed, we observe that when these voids area conforms to the IPC-A-610 (D or F) or IPC-7095A standards, macro voids do not have any significant effect on thermal cycling or drop shock performance.

Alpha Assembly Solutions

Weller Tools Launches the WSW Solder Wire Platform for the Perfect Solder Joint

Industry News | 2021-11-12 04:12:57.0

The perfect solder joint requires the perfect connection between the components because compromises lead to poor results, defects in the components and expensive rework. Weller's solder wire (WSW) platform provides only the best and exceeds expectations.

Weller/Apex Tool Group


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