Technical Library | 2013-01-17 15:37:21.0
A problem exists with electroless nickel / immersion gold (ENIG) surface finish on some pads, on some boards, that causes the solder joint to separate from the nickel surface, causing an open. The solder has wet and dissolved the gold. A weak tin to nickel intermetallic bond initially occurs, but the intermetallic bond cracks and separates when put under stress. Since the electroless nickel / immersion gold finish performs satisfactory in most applications, there had to be some area within the current chemistry process window that was satisfactory. The problem has been described as a 'BGA Black Pad Problem' or by HP as an 'Interfacial Fracture of BGA Packages…'[1]. A 24 variable experiment using three different chemistries was conducted during the ITRI (Interconnect Technology Research Institute) ENIG Project, Round 1, to investigate what process parameters of the chemical matrix were potentially satisfactory to use and which process parameters of the chemical matrix need to be avoided. The ITRI ENIG Project has completed Round 1 of testing and is now in the process of Round 2 TV (Test Vehicle) build.
Industry News | 2021-11-30 01:54:12.0
After more than 100 years of development, X-ray imaging technology has formed a relatively complete X-ray non-destructive testing (NDT) technology system. In order to meet these needs, new detection technologies are constantly innovating, using Xray inline inspection technology. It can not only detect invisible crack or porosity such as aluminum casting , but also qualitatively and quantitatively analyze the detection results to find flaws early.
This video presents how to replace and inspect BGA on PCB with our BGA rework station R720 & X ray inspection machine X6600. More details, pls contact me: WhatsApp?+86 18779975930 Skype?joyrongzhuomao@outlook.com Email: sales25@zhuomao.com.cn Link
This video presents how to replace and inspect BGA on PCB with our BGA rework station R720 & X ray inspection machine X6600. More details, pls contact me: WhatsApp?+86 18779975930 Skype?joyrongzhuomao@outlook.com Email: sales25@zhuomao.com.cn Link
Industry News | 2009-03-10 16:11:29.0
OSAKA, JAPAN � March 2009 � Nihon Superior Co. Ltd., a supplier of advanced soldering and brazing materials to the global market, announces that it will showcase a new, expanded range of SN100C products in booth 2564 at the upcoming APEX exhibition and conference, scheduled to take place March 31-April 2, 2009, in Las Vegas.
Industry News | 2014-01-09 11:15:15.0
Seika Machinery, Inc. announces that it will attend the SMTA Carolinas Expo & Tech Forum, scheduled to take place Thursday, January 23, 2014 at the Double Tree Raleigh Brownstone – University in Raleigh, NC. Seika will highlight the new HIOKI 1240 Flying Probe Tester and proven McDry Cabinets.
Industry News | 2018-01-16 11:59:10.0
Vision Engineering has teamed up with industry-expert Bob Willis to broadcast a free Electronics Academy Webinar aimed at identifying the issues affecting PCB/SMT assembly and the challenges of achieving Zero Defect Manufacture. The next webinar, Eliminate Printed Circuit Board Problems & Failure Modes will take place on January 23rd at 2:30 EST.
Industry News | 2016-05-16 20:44:43.0
Inovar, Inc., a full-service EMS provider, announces that it recently purchased and installed an XD7600NT Ruby X-ray Inspection System with X-Plane™ technology from Nordson DAGE.
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