Full Site - : crack on inductors (Page 7 of 8)

Re: PTH connectors mounted on SMD process

Electronics Forum | Wed Dec 29 14:30:28 EST 1999 | Dan Woodward

I am not sure if I have seen an article comparing solder joint strength Vs pressfit although I am sure this has been researched by literally hundreds of companies before they felt comfortable going to pressfit. I know one of the issues with solder is

Solder Joint Strength on Fine Pitch

Electronics Forum | Thu Aug 16 13:57:30 EDT 2001 | Hussman

Ouch! I thought that went away 12 years ago! Visual inspection to IPC standards should be used. Pulling and pushing leads is not even close to being consistent. I bet your customers or ISO auditors have never seen this practice. If they must pul

press fit on Ni/Au board finish

Electronics Forum | Mon Apr 29 05:25:13 EDT 2002 | ianchan

Hi, we do Sn plated I/O pinning insertion into Ni/Au thru' holes. no problems here so far, as we cater for the "interference" (fit-allowances) of the I/O pin into the thru' diameter, via improved PCB thru' hole designs. before this cater/considerati

press fit on Ni/Au board finish

Electronics Forum | Thu Apr 18 16:52:15 EDT 2002 | davef

General comments are: * First place I would look is the supplier of the pins that you are trying to install. Most suppliers that sell press fit components have done a good deal of work to qualify the component and will have all the specifications yo

Some ideas on Cracking in High Voltage Chip Caps

Electronics Forum | Tue May 26 18:17:22 EDT 1998 | Jerry

Our experience has been that mechanical crack occur vertically through the chip. In other words perpendicular to the board surface. You can sometimes tell through close inspection that the crack may have propogated from a point that the nozzle may

Hot Tear/Shirnk Hole>Will it happen on BGA joint ??

Electronics Forum | Fri Aug 08 07:15:49 EDT 2008 | davef

Hot tear occurs at the surface of the solder connection. The surface will look like someone tore the surface apart. So, it is a crack or fracture formed prior to metal solidification.

Siemens SIPLACE CF - Low vacuum on head

Electronics Forum | Mon Feb 04 01:26:57 EST 2019 | mst3000

Hi Ry-n, we have checked the hoses for any cracks. The vaccum measuring board was changed also. Its an S20. Thanks, Steve

Siemens SIPLACE CF - Low vacuum on head

Electronics Forum | Fri Feb 01 11:17:21 EST 2019 | youngbuck

Hi, Make sure to check any cracked, pinched, kinked hoses. Also when taking the whole gantry off there are clear hoses that can get pinched. Also, may want to changed the vaccum measuring board. Is this a S20 or F4,f5 or hs50 Thanks,

Re: Need info. on vib times for Siplace 80f4 Users

Electronics Forum | Mon Sep 14 21:40:25 EDT 1998 | Stefan W.

Unfortunatly there are too many variables to play with that you can't make a general rule for the vibration time. However, I suggest you increase the vibration time and lower the vibration force ( AC voltage ). For an SO 8, I would use 600 ms for an

Re: Need info. on vib times for Siplace 80f4 Users

Electronics Forum | Tue Sep 15 14:12:36 EDT 1998 | Justin Medernach

| Unfortunatly there are too many variables to play with that you can't make a general rule for the vibration time. | However, I suggest you increase the vibration time and lower the vibration force ( AC voltage ). For an SO 8, I would use 600 ms for


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