Industry Directory | Manufacturer
Suppliers of solder pastes, wave soldering liquid fluxes and SMT adhesives and cored solder wires for all soldering requirements.
Industry Directory | Consultant / Service Provider / Manufacturer
Mat-tech is your specialist in high-tech soldering & brazing. Whether it's developing a new product or improving an existing product, we provide the perfect joint.
New Equipment | Rework & Repair Equipment
BEST HeatShield Gel™ is a thermal shield water-based gel designed to be used in the PCB rework/repair or board assembly areas in order to provide thermal protection of electronic components. It is truly a revolutionary means to protect components. It
If you have boards requiring high tolerance mechanical dimension or odd shapes that traditional depaneling methods cannot handle. BEST Inc. provides laser depaneling services for printed circuit board manufacturers as well as EMS and OEMs. BEST’s nu
Used SMT Equipment | Soldering Equipment/Fluxes
Model: FlexSolder W620 Vintage: 2012 (demo’ed only, never used!) Description: Inline soldering system. (With servo driven XYZ gantry, and tilt able gripper from 0° to 7° degrees for direct PCB handling) Details: • Spray fluxer •
Used SMT Equipment | Screen Printers
EKRA X5 Professional Large, Screen and Stencil Printer Type: X5 Prof Large Serial Nr.: 805843 Year of Manufacture: 2014 Direction: Left to Right Voltage: 400V, 50/60Hz, 3 Phases Air Pressure: 6 Bar Printing Area: min.: 80x50mm, max.: 660x550mm Printe
Industry News | 2016-04-20 10:27:40.0
BEST, Inc. was presented Circuit Assembly’s NPI Award for its HeatShield Gel™ high temperature shielding product at the IPC APEX Expo on Feb. 24 in San Diego, Calif.
Industry News | 2016-01-05 16:10:10.0
Novel method for protecting electronic components from heat.
Technical Library | 2023-08-16 18:20:44.0
One of our defense customers planned to dispense underfill material for small and large die, using Hysol FP4545FC epoxy encapsulant. This process dissipates stress on solder joints and prevents cracking and fracturing between the bottom of the die and the surface of the substrate.
Technical Library | 2023-11-27 18:19:40.0
This page introduces major causes and countermeasures of solder crack in MLCCs (Multilayer Ceramic Chip Capacitors). Major causes of solder cracks Solder cracks on MLCCs developed from severe usage conditions after going on the market and during manufacturing processes such as soldering. Applications and boards that specially require solder crack countermeasures Solder cracks occur mainly because of thermal fatigue due to thermal shock or temperature cycles or the use of lead-free solder, which is hard and fragile.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Events Calendar | Sun Mar 15 18:30:00 UTC 2020 - Sun Mar 15 18:30:00 UTC 2020 | ,
BGA & Area Array Failures, Causes & Corrective Actions Online Webinar
Events Calendar | Sun Apr 11 18:30:00 UTC 2021 - Sun Apr 11 18:30:00 UTC 2021 | ,
Europe Chapter Webinar: Tombstoning Components during Reflow Soldering - Causes & Cures
Career Center | , Maryland USA | Engineering
Late stage start-up company, well into commercialization, that develops and manufactures products to precisely control the instantaneous release of heat energy for reaction initiation and joining applications. Building from its strengths in material
Career Center | Space Coast, Florida USA | Engineering,Research and Development
Board Level Assembly BGA Expert! We are in need of an Electronic Packaging or Advanced Manufacturing Engineer to work with the Advanced Manufacturing Technology Group of a major Florida based Communications company. Support IR&D and Program activit
Career Center | Georgetown, Penang | Engineering
Philips Lumileds Lighting Sdn. Bhd Position Title : SMT Engineer Specialization : Manufacturing/Production Operations Industry : Electrical & Electronics Duration : May 2006 - Present Work Description: To conduct NPI & all SMT related process in Lu
Career Center | , Abu Dhabi | Engineering,Management,Production,Sales/Marketing
• Strong technical leadership and decision-making skills; strong verbal and written communication skills to provide clear, crisp direction for key issue resolution; and good team skills to facilitate cross-functional cross -site team effectiveness.
SMTnet Express, January 25, 2024, Subscribers: 25,319, Companies: 12,002, Users: 28,668 █ Electronics Manufacturing Technical Articles Cracks: The Hidden Defect Cracks in ceramic chip capacitors can be introduced at any process step
SMTnet Express, February 29, 2024, Subscribers: 25,362, Companies: 12,025, Users: 28,728 █ Electronics Manufacturing Technical Articles Cracks: The Hidden Defect Cracks in ceramic chip capacitors can be introduced at any process step
| https://www.eptac.com/soldertips/problems-with-stress-cracks-in-ceramic-components/
. Although it may not be seen at this time, the ceramic will fracture when exposed to heat cycles. Solder paste, Tin/Lead or Lead-Free. Lead-Free is more brittle and the stress relief will be absorbed by the component causing it to crack
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/1066-voids-in-solder
) Direct Bond Copper Defects - Application Note 1066 Sample & Method This rectifier has three ceramic substrates solder bonded to a copper base
