Full Site - : crack solder joints connector (Page 14 of 61)

Under what conditions do you set different temperatures for the TOP and Bottom heating elements of a reflow oven?

Industry News | 2018-10-18 10:12:06.0

Under what conditions do you set different temperatures for the TOP and Bottom heating elements of a reflow oven?

Flason Electronic Co.,limited

Indium Corporation Expert to Host Power Electronics Webinar

Industry News | 2020-06-18 14:22:04.0

Indium Corporation's Karthik Vijay, Technical Manager, Europe, Africa, and the Middle East, will host a power electronics webinar featuring InFORMS® as part of Indium Corporation's InSIDER Series on Webex at 11 a.m. EST on Tuesday, June 23.

Indium Corporation

Typical RoHS Issues in PCB Assembly

Industry News | 2018-10-18 10:23:07.0

Typical RoHS Issues in PCB Assembly

Flason Electronic Co.,limited

Indium Corporation to Feature Solutions for Thermal Management and Advanced Packaging at IMAPS Symposium

Industry News | 2023-09-25 20:04:34.0

Indium Corporation® will proudly feature an array of innovative materials solutions for thermal management and advanced packaging applications at the IMAPS International Symposium on Microelectronics, October 3-4, in San Diego, California.

Indium Corporation

Indium Corporation Honored with Two Global Technology Awards at Productronica

Industry News | 2023-11-20 15:34:41.0

Indium Corporation was honored with two prestigious GLOBAL Technology Awards during an awards ceremony on November 14 at Productronica in Munich, Germany. The company was honored in both the Flux and Adhesives/Underfills Encapsulants categories for NC-809, a halogen-free, ultra-low residue flip-chip flux, and InTACK™, a drop-in, robust tacking agent for power module assembly, respectively. Presented by Global SMT & Packaging, the Global Technology Awards recognize the best new innovations in the printed circuit assembly and packaging industries introduced in the past 12 months.

Indium Corporation

Nihon Superior to Showcase Newly Expanded Range of SN100C Soldering Materials at Mexitr�nica 2008

Industry News | 2008-10-07 20:52:28.0

OSAKA, JAPAN � October 2008 � Nihon Superior USA, a subsidiary of Nihon Superior Co. Ltd., an advanced soldering supplier to the worldwide market, announces that it will feature a newly expanded range of SN100C products, which includes new halogen-free solder paste, in booth 402 at the upcoming Mexitr�nica exhibition, scheduled to take place October 21-23, 2008 at the Expo Guadalajara, Hotel Hilton, in Guadalajara, Jalisco, M�xico.

Nihon Superior Co., Ltd.

ECOSELECT1 - The Perfect Start-up Solution for Efficient Selective Soldering

Industry News | 2011-12-01 14:01:34.0

Ersa has expanded its product range by the ECOSELECT 1: a selective soldering machine requiring less than 3 m² of space - thus fitting optimally into cell production environments.

kurtz ersa Corporation

Inspection System Can See Under BGAs

Industry News | 2003-04-07 11:00:15.0

The innovative VPI-1000 optical inspection system is the only benchtop SMT inspection system capable of inspecting BGA devices as standard, without necessitating a lengthy lens reconfiguration.

Metcal

Indium Corporation to Feature Products for HIA and SiP at IMAPS Boston

Industry News | 2022-09-19 05:59:24.0

Indium Corporation® will feature innovative material solutions designed to meet the evolving challenges of SiP and HIA at the 55th International Symposium on Microelectronics (IMAPS) from Oct. 3-6 in Boston, Mass., U.S.

Indium Corporation

Press-fit Technology

Industry News | 2019-11-05 22:23:45.0

The basic principle of a press-fit connection is that a contact terminal is pressed into a printed circuit board (PCB). There are two types of press-fit pins – the solid pin with a solid press-in zone and the compliant pin with an elastic press-in zone. In this article, we’ll discuss the elastic press-in zone.

Headpcb


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