New Equipment | Wave Soldering
Selective Soldering Machine ERSA ECOSELECT 4 Selective Soldering Machine ERSA ECOSELECT 4 ERSA ECOSELECT 4 Selective Soldering System Selective Soldering Machine Product description: Selective Soldering Machine ERSA ECOSELECT 4 INQUIR
In-Line X-ray Inspection System Automatically in-line inspect Solder joint defects of PCBA and other defects on Hidden Components. Able to judge Good/NG fast with inspection speed of 1sec/FOV and the program can set ROIs conveniently. Performing X-r
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Seamark BGA chip welding inspection machine sealed tube x ray inspection X-5600 for quality inspection Product Application: X-Ray inspection is a method of non-destructive testing where many types of manufactured components can be examined to veri
We provide SMT x-ray chip counter, BGA rework station and customized X-ray solution, for more information, contact me by: whatsapp:0086 134 3448 1030 skype:ritaleeli Email:sales11@zhuomao.com.cn Seaamark Zhuomao 2D off-line x ray inspection equi
Automated inspection system designed for sophisticated high-speed inspection in SMT production. Transmission X-ray Technology with patented Slice-Filter-Technique (SFT) and Off-Axis Technology present a reliable solution for the in-line inspection of
New Equipment | Selective Soldering
Flason SMT Selective Wave Soldering Machine max solder temperature 350℃ solder pot capacity 15 KG dimension L1280mm X W1400mm X H1650mm Net weight 380KG Product description: Off line Selective Wave Soldering Machine INQUIRY
Industry News | 2010-09-02 10:54:09.0
Nihon Superior Co. Ltd., a supplier of advanced soldering materials to the global market, announces that the research it sponsored at the University of Queensland, Australia provided the basis for the paper that earned an ICEP Outstanding Paper Award.
Technical Library | 2013-01-17 15:37:21.0
A problem exists with electroless nickel / immersion gold (ENIG) surface finish on some pads, on some boards, that causes the solder joint to separate from the nickel surface, causing an open. The solder has wet and dissolved the gold. A weak tin to nickel intermetallic bond initially occurs, but the intermetallic bond cracks and separates when put under stress. Since the electroless nickel / immersion gold finish performs satisfactory in most applications, there had to be some area within the current chemistry process window that was satisfactory. The problem has been described as a 'BGA Black Pad Problem' or by HP as an 'Interfacial Fracture of BGA Packages…'[1]. A 24 variable experiment using three different chemistries was conducted during the ITRI (Interconnect Technology Research Institute) ENIG Project, Round 1, to investigate what process parameters of the chemical matrix were potentially satisfactory to use and which process parameters of the chemical matrix need to be avoided. The ITRI ENIG Project has completed Round 1 of testing and is now in the process of Round 2 TV (Test Vehicle) build.
No damage X-ray detecting system SMT Battery IC inner circuit X ray inspecting machine X7600 Customized X-ray inspect solution for your products, you are welcome to contact Rita Li by Whatsapp/Wechat/Viber:0086-134 3448 1030 Microfocus X-ray inspe
Industry News | 2016-08-19 05:00:52.0
If you have a process problem, let NPL Defect of the Month Video help you team
