Electronics Forum | Mon Feb 08 14:32:01 EST 2010 | davef
We believe that neither xray nor SAM will provide satisfactory results and that sectioning throughout the process will provide conclusive information.
Electronics Forum | Mon Feb 08 16:11:10 EST 2010 | glennster
Dave, I agree totally, but dye-and-pry should also be part of the evaluation. Glenn Robertson Process Sciences Inc
Electronics Forum | Mon Feb 08 20:09:49 EST 2010 | davef
Woody: Consider using test BGA with no chip in, but daisy chains that you can monitor. After soldering, run environmental tests and follow with electrical tests to determine if the product concept is good enough.
Electronics Forum | Mon Feb 08 23:44:31 EST 2010 | glennster
Woody, Daisy chain packages are definitely needed, but if you can get packages with a dummy chip inside these will provide a more accurate simulation of working components. If possible, continuous monitoring of resistance during the test will be
Electronics Forum | Wed Feb 10 12:15:40 EST 2010 | woodsmt
Daisy chained parts and impedence testing were my original reccomendation. Unfourtuantely I can not get the resources for this testing.
Electronics Forum | Tue Jun 22 08:37:52 EDT 2010 | davef
Dennis: These "terminal detach failures" probably are caused by thermal shocking of the components. * Preheat the components * Use a hot air pencil rather than a soldering iron
Electronics Forum | Fri Jun 25 05:34:40 EDT 2010 | ppcbs
Hi iv40 Try with NIC ceramic capacitor that was tested in wet process. We hav succeed with these cap after we found some failure with Kemet ceramic Cap which tested in dry test process while manufacturing.
Electronics Forum | Fri Jun 25 08:38:37 EDT 2010 | mun4o
Thanks, Dennis. That is a good idea, but I have problem :) - our logistic department lookig for cheap components...What other mnfg of cap you use? Regards,
Electronics Forum | Mon Jul 12 00:20:11 EDT 2010 | leadthree
After a detailed check the cracking was most likely from the ICT and a variation in the length of the probes (due to wear and tear) that press down the PCB. I am very certain that was the reason.
Electronics Forum | Thu Aug 26 03:58:32 EDT 2010 | jacki
Hi all Did anyone encounter that the thermal crack failure or any failure issue by using the Kemet Ceramic Cap, particularly 0.1uF,while wave soldering? Before using this part, I want to clarify whether it is suitable for our process or not. Thanks i
