Electronics Forum | Wed Jul 10 18:19:42 EDT 2002 | davef
Flex cracking under the terminations is generally regarded as one of the primary causes of failure of ceramic chips. If you can see cracks in the solder joints from board flex, those chips are certainly strongly suspect, and you must assume there is
Electronics Forum | Fri Jul 12 01:38:06 EDT 2002 | redmary
thanks, Dave. who are specialized in mechnical stress distribution? because I find the gap in the capacitor, but why? If the crack is caused by the exteral mechnical stress, which shape will be formed, zigzag or linear?
Electronics Forum | Wed Jul 10 04:53:47 EDT 2002 | redmary
a leakage exists in the capacitor net (1206), which cause the voltage down so much. the process flow is: printing-placement-reflow-hand load-wave-depanel-FT. I find possible stress maybe exists in the depanel stage, does the extra stress cause the ca
Electronics Forum | Tue Nov 07 22:41:48 EST 2006 | davef
You are correct that hand soldering ceramic capacitors often causes them to crack. They do not take thermal shock well. You might be able to reduce the amount of cracking by following the rework repair guidelines discussed in the fine SMTnet Archiv
Electronics Forum | Fri Apr 13 05:07:57 EDT 2001 | zam_bri
Hi Dave, Thanx for your reply. What is it in the process of manufacturing the capacitor that can go wrong until it can caused the chips to be chipped-off or cracks. I've encountered alot of this problem lately. First I thought it was our process t
Electronics Forum | Wed Apr 11 23:47:14 EDT 2001 | zam_bri
Thank you for the feedback guys. The concerns I have is related to components' performance as well as chipped-off & cracks. Does the performance also degrading over the time? thx
Electronics Forum | Thu Apr 12 20:27:10 EDT 2001 | davef
Tantalum caps degrade over time. You should not be seeing "chipped-off & cracks" regardless of the age. This should not be a shelf-life issue, unless you are storing them in an aquarium. Tell us the story. Solderability is a shelf-life issue and
Electronics Forum | Thu Nov 13 09:14:52 EST 2008 | raiders
Hi All, We encounter capacitor crack in the ICT, it contributes 2% of the failure. We are not sure whether these crack coming from the SMT. All these crack having the same pattern. Please refer to attached file. Anybody encounter the same thing befo
Electronics Forum | Thu Nov 13 13:07:04 EST 2008 | vladig
Yes, it does look like a typical crack due to mechanical overloading (bending) of teh component. Usually because of the board flexing Vlad
Electronics Forum | Thu Nov 13 11:45:04 EST 2008 | pbarton
We have seen a similar problem. Turned out to be mechanical stress on the component caused by the method of location and clamping at ICT. Where is the component located on the assembly? Poorly adjusted clamping pillars on clamshell fixtures can cause
