Electronics Forum | Tue Mar 09 22:13:20 EST 2004 | Ken
What x-ray system are you using? Check out Dage. I bet you have voids...just can't image them. Why the fuss over voids? Voids terminate the crack propegation and can extend the time to failure for creep fatigue. I would not be concerned unless yo
Electronics Forum | Thu Jan 08 10:56:13 EST 2009 | aj
Hi, Is there any PTH Assembly after reflow, we found cracked joints on some BGAs which was caused by operators ing Oupin connectors which were a tight fit. This caused the PCB to flex hence cracking joints. One way of checking for this during test
Electronics Forum | Tue Nov 01 09:57:18 EST 2005 | Chris
Hi, I am experiencing cracked solder joints on ceramic resonators after the ultrasonic plastic weld process. PCB assy is placed into plastic housing and then housing halves are ultrasonic welded. Not a soldering problem. I know this component is
Electronics Forum | Wed Sep 13 10:25:00 EDT 2000 | Charlie
Hello, Can you tell me the prime cause of cracked solder joint on a surface mount part? Charlie,
Electronics Forum | Fri May 31 05:54:09 EDT 2019 | dhanish
What are the common cause for solder joint crack after the pcba go through Temperature cycling test ?We have seen failure on solder joint for the memory part.
Electronics Forum | Fri Jun 19 09:45:21 EDT 1998 | Mike Cox
Has anyone had experience with placing BGA on gold plated boards. I thought I read a while ago there was a problem with embrittlment causing cracked joints. If anyone has experience with this your feedback would be great. Mike
Electronics Forum | Tue Jun 25 09:45:39 EDT 2019 | edhare
See also ... https://www.semlab.com/solder-joint-failure-modes/
Electronics Forum | Wed Jul 10 22:32:46 EDT 2002 | redmary
i just find the gap inside the component from the cross-section, it indeed exists the interal crack, not solder joint crack. but why the failed capacitor is well after some time. and the other suspicion is the quality of the component.
Electronics Forum | Mon Sep 15 06:14:49 EDT 2008 | milas
Hi Has anyone experienced laminateand BGA cracking on ENIG finish boards built using a lead free process? The laminate is cracked directly underneath the pad where the solder joint has cracked. We have confirmed the cracking via Microsectioning. We
Electronics Forum | Sat Jun 01 04:22:24 EDT 2019 | gregoryyork
Depends on lead free alloy choice as well
