Industry News | 2021-04-29 16:58:08.0
At the 30th anniversary of NEPCON China, Koh Young Technology, the industry leader in True3D™ measurement-based inspection solutions will exhibit a full suite of inspection and process control solutions at NEPCON China in Booth 1H15 Zone A on April 21-23, 2021 at the Shanghai World Expo Exhibition & Convention Centre.
Industry News | 2009-03-05 15:03:01.0
OSAKA, JAPAN � March 2009 � Nihon Superior Co. Ltd., a supplier of advanced soldering and brazing materials to the global market, announces the development of SN100C P520 D5 lead-free solder paste for 0402 metric chip components.
Industry News | 2014-08-26 16:50:47.0
Viscom announced today that it will exhibit in Booth #434 at SMTA International, scheduled to take place Sep. 30 - Oct. 1, 2014 at the Donald Stephens Convention Center in Rosemont, IL.
Industry News | 2015-08-27 13:22:43.0
Viscom announced today that it will exhibit in Booth #506 at SMTA International, scheduled to take place Sep. 29 - 30, 2015 at the Donald Stephens Convention Center in Rosemont, IL. Viscom’s applications experts will present the company’s new 3D AOI and CCI systems.
Industry News | 2020-12-01 17:17:03.0
Indium Corporation's Joe Hertline, Product Manager – ESM/Power Electronics, will present during a live technical webinar on power electronics for IMAPS on Wednesday, December 9 at 12 p.m. Eastern Time (5 p.m. British Time/1 a.m. Thursday, Dec. 10 Malaysia Time).
Industry News | 2011-01-14 13:06:07.0
Nihon Superior Co. Ltd. will exhibit in Booth # East 30-14 at the upcoming INTERNEPCON JAPAN, scheduled to take place January 19-21, 2011 at the Tokyo Big Sight in Tokyo, Japan.
Industry News | 2011-03-14 17:59:18.0
Nihon Superior Co. Ltd. will exhibit in Booth #259 at the upcoming IPC APEX EXPO, scheduled to take place April 12-14, 2011 at the Mandalay Bay Resort & Convention Center in Las Vegas.
Industry News | 2012-04-10 14:47:49.0
The Balver Zinn/Cobar Group announces that its SN100C Wire Solder and Cobrush flux applicator were demonstrated at the first Hand Solder Competition at the recently held IPC APEX EXPO in San Diego.
Industry News | 2018-11-14 15:34:52.0
Viscom AG will premier a new 3D bond inspection system at electronica 2018 in Munich. The Hanover-based inspection technology expert is thus expanding its diverse 3D product range from 3D SPI, 3D AOI and 3D X-ray technology to include bond inspection, further reinforcing its technology leadership in 3D inline inspection for the electronics manufacturing industry.
Industry News | 2009-03-02 00:10:24.0
TORRANCE, CA � February 2009 � Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, announces that it will verbally represent its complete line of products and technologies at the upcoming SMTA Dallas Expo and Tech Forum, scheduled to take place Tuesday, March 3, 2009 at the Richardson Civic Center in Richardson (Dallas), Texas. Michelle Ogihara, Seika Machinery's Sales and Marketing Manager, will have product brochures available in the booth. Additionally, she will be available to answer questions about the company's products.
