The inspection of big pipes is a time-costly procedure. Modern real-time DR-systems result in a huge efficiency gain in comparison to the conventional film (RT) approach. VisiConsult developed cutting edge custom systems with weld tracking, defect ma
The inspection of welded tanks is a time-costly procedure. Modern real-time DR-systems result in a huge efficiency gain in comparison to the conventional film (RT) approach. VisiConsult developed a cutting edge custom system with weld tracking, defec
Electronics Forum | Mon Feb 22 10:19:57 EST 2010 | swag
Check/reseat all connections on axis driver card and from driver card to step motor. On older MpM's it is common to get a bad connection on the connector for axis driver power and blow components on your driver board. Reseating these connectors mig
Electronics Forum | Wed May 08 06:16:14 EDT 2019 | robstevenson
I am looking for a download link for Aegis Software Version 7.07.20 which I think was the latest version. As had corrupt hard disk so lost installation files and I am not on Aegis Support Contract. I an not looking for a cracked version as I have a p
Used SMT Equipment | Pick and Place/Feeders
Make: ASMModel: ASM SIPLACE TX4i Details:1.High Speed: The SIPLACE TX modules can achieve a placement speed of up to 78,000 cph, ensuring high-efficiency production. 2.High Accuracy: With a precision of up to 22 pm, the machine ensures high-quality
Used SMT Equipment | Pick and Place/Feeders
Make: ASMModel: ASM SIPLACE TX4i Details:1.High Speed: The SIPLACE TX modules can achieve a placement speed of up to 78,000 cph, ensuring high-efficiency production. 2.High Accuracy: With a precision of up to 22 pm, the machine ensures high-quality
Industry News | 2014-03-28 09:54:48.0
IPC – Association Connecting Electronics Industries® presented Committee Leadership, Distinguished Committee Service and Special Recognition Awards at IPC APEX EXPO® at Mandalay Bay Convention Center in Las Vegas.
Industry News | 2018-10-18 09:37:27.0
How To Set Profile In SMT Reflow Oven
Technical Library | 2021-07-20 20:02:29.0
During the manufacturing of printed circuit boards (PCBs) for a Flight Project, it was found that a European manufacturer was building its boards to a European standard that had no requirement for copper wrap on the vias. The amount of copper wrap that was measured on coupons from the panel containing the boards of interest was less than the amount specified in IPC-6012 Rev B, Class 3. To help determine the reliability and usability of the boards, three sets of tests and a simulation were run. The test results, along with results of simulation and destructive physical analysis, are presented in this paper. The first experiment involved subjecting coupons from the panels supplied by the European manufacturer to thermal cycling. After 17 000 cycles, the test was stopped with no failures. A second set of accelerated tests involved comparing the thermal fatigue life of test samples made from FR4 and polyimide with varying amounts of copper wrap. Again, the testing did not reveal any failures. The third test involved using interconnect stress test coupons with through-hole vias and blind vias that were subjected to elevated temperatures to accelerate fatigue failures. While there were failures, as expected, the failures were at barrel cracks. In addition to the experiments, this paper also discusses the results of finite-element analysis using simulation software that was used to model plated-through holes under thermal stress using a steady-state analysis, also showing the main failure mode was barrel cracking. The tests show that although copper wrap was sought as a better alternative to butt joints between barrel plating and copper foil layers, manufacturability remains challenging and attempts to meet the requirements often result in features that reduce the reliability of the boards. Experimental and simulation work discussed in this paper indicate that the standard requirements for copper wrap are not contributing to the overall board reliability, although it should be added that a design with a butt joint is going to be a higher risk than a reduced copper wrap design. The study further shows that procurement requirements for wrap plating thickness from Class 3 to Class 2 would pose little risk to reliability (minimum 5 μm/0.197 mil for all via types).Experimental results corroborated by modeling indicate that the stress maxima are internal to the barrels rather than at the wrap location. In fact, the existence of Cu wrap was determined to have no appreciable effect on reliability.
Guillotine type V-cut PCB Cutting Machine Product Description 1. For internal strength generates during separation, Minimize it to value under 180uE ,to avoid solder crack or component damage 2. Able to separate edge of V-slot, minimum distance to
Guillotine type V-cut PCB Cutting Machine Product Description 1. For internal strength generates during separation, Minimize it to value under 180uE ,to avoid solder crack or component damage 2. Able to separate edge of V-slot, minimum distance to
Career Center | Fayetteville, Arkansas USA | Engineering,Production
I enjoyed working in Electronics Manufacturing while in college (BSEE) and would like to pursue an engineering job in a related field.
Career Center | binan city, Laguna Philippines | Engineering,Maintenance,Technical Support
6.5 Years Experience in Semiconductor Industry Specializing in Dispensing process and Equipment. 5.0 Years of Experience in Field Service Engineering. Machine Commissioning / Customer support 24 / 7, Technical Support for Customer machine and process
SMTnet Express, December 23, 2015, Subscribers: 23,927, Members: Companies: 14,845, Users: 39,621 PCB Fabrication Processes and Their Effects on Fine Copper Barrel Cracks Edward Arthur, Charles Busa, Melissa Durfee, Chad Gibson, Wade Goldman P
SMTnet Express, October 28, 2021, Subscribers: 26,544, Companies: 11,461, Users: 26,907 Cracks: The Hidden Defect Cracks in ceramic chip capacitors can be introduced at any process step during surface mount assembly. Thermal shock
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