Industry News | 2009-12-14 21:32:34.0
Vicor, a leader in the development, manufacture and sale of power conversion components and systems since 1981, has purchased Universal Instruments’ Genesis Platform based on its unique ability to adapt to a wide range of process requirements. The new equipment will be used for Vicor’s leading-edge VI Chip line of power conversion products, from low-volume/high-mix, to high-volume, as well as a specialized post-SMT assembly process requiring unique tooling and software solutions. Universal’s ability to provide a complete turn-key solution, rather than the hardware alone, differentiated Genesis from the alternative providers.
Industry News | 2021-11-30 01:54:12.0
After more than 100 years of development, X-ray imaging technology has formed a relatively complete X-ray non-destructive testing (NDT) technology system. In order to meet these needs, new detection technologies are constantly innovating, using Xray inline inspection technology. It can not only detect invisible crack or porosity such as aluminum casting , but also qualitatively and quantitatively analyze the detection results to find flaws early.
Industry News | 2016-08-19 05:00:52.0
If you have a process problem, let NPL Defect of the Month Video help you team
Industry News | 2012-07-23 08:17:40.0
PRIDE Industries, Inc. now can handle board sizes up to 1200 mm with the addition of a JX-100LED from Juki Automation Systems.
Industry News | 2012-09-17 15:38:30.0
SEHO North America, Inc. announces that Christian Ott, Senior Sales and Project Manager, will present a paper titled “Reduction of Voids in Solder Joints …
Electronics Forum | Mon Oct 06 11:13:32 EDT 2003 | marmotzj
Dear All, I'm encountering a problem on mounting Intel E7501 and P64H2 FC-BGA chips. After the SMT process, these two BGAs were defected. Both had power-to-ground short circuits on the die package itself, and also the die resin had cracking tracks
Electronics Forum | Tue Jun 17 01:27:25 EDT 2003 | Dreamsniper
Hi Guys, I need your opinion here. Has anyone tried doing this Process: Bottomside Process first which means gluing the chip components then reflowing the Glue instead of Curing them, then Topside process which is solder paste printing then compone
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