Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Used SMT Equipment | In-Circuit Testers
Description Make: Takaya Model: APT-9411CE Year: 2010 Type: Flying Probe Details: Takaya APT 9411 CE Flying Probe The APT-9411CE is designed for users who are looking for a precise and reliable test system with an easy to use softwar
Training Courses | | | IPC Designer Certification CID
The Certified IPC Designer CID (Certified Interconnect Designer) course is the industry's premier professional development program for experienced PCB design professionals.
Training Courses | | | IPC Designer Certification CID
The Certified IPC Designer CID (Certified Interconnect Designer) course is the industry's premier professional development program for experienced PCB design professionals.
Training Courses | | | IPC Designer Certification CID
The Certified IPC Designer CID (Certified Interconnect Designer) course is the industry's premier professional development program for experienced PCB design professionals.
Training Courses | | | IPC Designer Certification CID
The Certified IPC Designer CID (Certified Interconnect Designer) course is the industry's premier professional development program for experienced PCB design professionals.
Training Courses | | | IPC Designer Certification CID
The Certified IPC Designer CID (Certified Interconnect Designer) course is the industry's premier professional development program for experienced PCB design professionals.
Training Courses | | | IPC Designer Certification CID+
The CID+ is the advanced version of the Certified IPC Interconnect Designer (CID) program targeted toward those working in the PCB design industry.
Training Courses | | | Other Courses
Other courses related to electronics manufacturing and assembly
Technical Library | 2019-05-21 17:20:36.0
Die attach material selection and process implementation play crucial roles in any microelectronic assembly. The chosen attach methods ultimately affect die stress, functionality, thermal management, and reliability of the assembly. Die attach applications are designed to optimize mechanical attachment of the die to the substrate, to create a thermal path from the die to the substrate, and to create an electrical path for a ground plane connection. Some of the more commonly used die attach materials in the microelectronics industry today are epoxies,polyimides, thermoplastics, silicones, solders, and special low outgassing, low stress, anisotropic adhesives.
