Events Calendar | Tue Mar 12 00:00:00 EDT 2019 - Thu Mar 14 00:00:00 EDT 2019 | Munich, Germany
LOPEC 2019 - 11th International Exhibition for the Printed Electronics Industry
New Equipment | Solder Materials
Fine Line Stencil is a technology leading manufacture, committed to delivering the highest quality laser stencils and related products in the industry. Fine Line Stencils highly-polished PrintMaster and Slic-Blade nickel squeegee blades offer impro
New Equipment | Cable & Wire Harness Equipment
Overview The CableCoiler 4000 is a motorized heavy-duty cable coiling machine designed to interface with the MegaStrip 9600. It coils cable up to an inner diameter of 600 mm (23.6") and handles cable coils weighing up to 80 kg (178 lbs.) Processi
Consisting of multiple laminates and differing dielectric constants, this multilayer (displayed right) is a mixed-dielectric printed circuit board which was manufactured for the Aerospace Industry. Multilayer Mixed Dielectric PCB Specifications:
This multilayer, high-frequency coupler, shown above, is used within a communications application for the telecom industry. Multilayer High Frequency Coupler Specifications: Product Description This Multi-Layer High-Frequency Coupler is used with
New Equipment | ESD Control Supplies
Polyester wiper is constructed from continuous filament microdenier polyester.These strong filaments have a high yarn-to dust contact surface area,ensuring excellent wiping efficiency.Furthermore,its wedge-shaped cross-section acts as squeegies for s
The YXLON Cheetah EVO series was designed to provide the "best-in-class" inspection solution for SMT, semiconductor, and laboratory assembly applications. With optimitzed software and hardware, these systems produce higher quality and more consistent
New Equipment | Cable & Wire Harness Equipment
An excellent solution for customers looking for a simple, low-cost crimping press. The UniCrimp 100 can deliver up to 2.2 tons (20 kN) of crimping force for applications up to 6 mm2 (10AWG). Simple design that is very easy to use. Extremely cost
Industry News | 2012-09-17 16:02:44.0
Nordson DAGEa division of Nordson Corporation (NASDAQ: NDSN), announces that Dr. Evstatin Krastev, International Applications Engineering Manager, will present a paper titled “3D board level X-Ray inspection via Limited Angle Computer Tomography” at the upcoming SMTA International Conference & Exhibition