Industry News | 2003-05-05 09:21:23.0
Features a 50% Reduction in Length
Industry News | 2003-07-09 08:49:20.0
Proposed offering of 3,000,000 shares of its common stock.
Used SMT Equipment | Pick and Place/Feeders
Product number: YSI- v Products in detail Object substrate: L50 W50mm ~ L330 W360mm xx (1) does When using standard components: absoluteaccuracy (including + 3 sigma) : + / - 0.05 mm/QFP Repeat accuracy (3 sigma) : + / - 0.03mm/QFP SMT capacity:
Used SMT Equipment | SMT Equipment
Product name: YC - 8 YAMAHA irregular chip mounter Product number: YC - 8 Products in detail Object substrate: L50 W50mm ~ L330 W360mm x x (1) does When using standard components: absolute accuracy (including + 3 sigma) : + / - 0.05 mm/QFP Rep
Used SMT Equipment | SMT Equipment
Product name: YC8 small modular chip mounter Product number: YC8 Products in detail Features: support large irregular component small modular placement machine Object substrate: L50 W50mm ~ L330 W360mm x x (1) does When using standard componen
Used SMT Equipment | SMT Equipment
Product name: YSi -v yamaha intelligent alien chip mounter Product number: YSi - v Products in detail Object substrate: L50 W50mm ~ L330 W360mm x x (1) does When using standard components: absolute accuracy (including + 3 sigma) : + / - 0.05 mm
Used SMT Equipment | SMT Equipment
Product name: YC8 small modular chip mounter Product number: YC8 Products in detail Features: support large irregular component small modular placement machine Object substrate: L50 W50mm ~ L330 W360mm x x (1) does When using standard componen
Used SMT Equipment | SMT Equipment
Product name: YC - 8 YAMAHA irregular chip mounter Product number: YC - 8 Products in detail Object substrate: L50 W50mm ~ L330 W360mm x x (1) does When using standard components: absolute accuracy (including + 3 sigma) : + / - 0.05 mm/QFP Rep
Used SMT Equipment | SMT Equipment
Product name: YSi -v yamaha intelligent alien chip mounter Product number: YSi - v Products in detail Object substrate: L50 W50mm ~ L330 W360mm x x (1) does When using standard components: absolute accuracy (including + 3 sigma) : + / - 0.05 mm
Technical Library | 2019-06-19 11:06:46.0
Tin (Sn) metal displays the characteristic of growing “tin whiskers” from pure tin coatings (most actively on relatively thin, electrodeposited or immersion tin coatings), usually months or years from the initial deposition of the tin. Tin whiskers are electrically conductive, filamentary, single crystals of white (beta phase) tin. These filaments of single crystal tin are usually one to five microns in diameter, and a few microns up to several tens of millimeters long, that grow spontaneously from the tin coatings. Alloying additions of several percent (by weight) of lead (Pb) prevents these electrically conductive tin whiskers from growing. Pb alloyed into the Sn was discovered to prevent the occurrence of tin whiskers in electronic assemblies in the 1950s as the Bell Laboratories solution to the problem of tin whiskers. The alloying of the tin with lead has thus quietly averted incalculable losses from short circuits in electronic equipment for the last 60 years.
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