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Products, services, training & consulting for the assembly, rework & repair of electronic assemblies. BGA process experts. Manufacturers Rep, Distributor & Service Provider for Seamark/Zhuomao and Shuttle Star BGA Rework Stations.
Since 1982 CSP has been providing copper and fiber optic cable assemblies for the OEM, CATV and telecommunications markets. We specialize in extremely complex cable assemblies. CSP is an ISO9001 company in Minneapolis, Minnesota. 1-800-4-CABLES
YAMAHA YV88 Full Automatic High Speed Chip Mounter Board size MAX.460 x 335 MIN.50 x 50 mm PCB Thickness 0.4 ~ 3.0mm Conveyor Transfer Right→ Left(Left→ Right:Option)
Refurbished YAMAHA YV100xg Pick and Place Machine Machine Type YV100XG Substrate size M type L460 * W335 (MAX) -L50 * W50 (MIN) L type L460 * W440 (MAX) -L50 * W50 (MIN) Mounting accuracy Absolute
Used SMT Equipment | Pick and Place/Feeders
Product number: YV100XG Products in detail YAMAHA multi-function chip mounter YAMAHAYV100XG High speed and high precisionmulti-function modular placement machine 0.18 seconds/CHIP ultra-high-speed SMT(best conditions) 16200 CPH (grain per hour)
Used SMT Equipment | Pick and Place/Feeders
Product number: YV100XGP Products in detail YAMAHA multi-function chip mounter YAMAHAYV100XGP High speed and high precisionmulti-function modular placement machine 0.18 seconds/CHIP ultra-high-speed SMT(best conditions) 16200 CPH (grain per hour)
Industry News | 2003-02-25 09:10:01.0
The CSPEMI400 complements California Micro Devices' broad portfolio of CSP (chip scale package) devices for stand-alone ESD protection and EMI filter arrays with ESD protection, making it the most extensive in the industry.
Industry News | 2003-06-25 12:49:17.0
Additional state of the art automated surface mount assembly equipment has been installed to provide expanded capacity for advanced technology printed circuit assemblies
Technical Library | 2023-01-17 17:22:28.0
The impact of voiding on the solder joint integrity of ball grid arrays (BGAs)/chip scale packages (CSPs) can be a topic of lengthy and energetic discussion. Detailed industry investigations have shown that voids have little effect on solder joint integrity unless they fall into specific location/geometry configurations. These investigations have focused on thermal cycle testing at 0°C-100°C, which is typically used to evaluate commercial electronic products. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC- 9701 specification for tin/lead solder alloys. This temperature range is more typical of military and other high performance product use environments. A proposed BGA void requirement revision for the IPC-JSTD-001 specification will be extracted from the results analysis.
Technical Library | 2024-08-20 00:40:08.0
In electronics manufacturing, 'Underfill' refers to a material that is applied to fill the gap between a semiconductor device, such as flip-chip assemblies, Ball Grid Arrays (BGA), or Chip Scale Packages (CSP), and the substrate, such as a PCB or flex circuit.
Refurbished YAMAHA YV100XG SMT Pick and Place Machine Machine Type YV100XG Substrate size M type L460 * W335 (MAX) -L50 * W50 (MIN) L type L460 * W440 (MAX) -L50 * W50 (MIN) Mounting accuracy Absolute accuracy (μ + 3σ): ± 0
Dual valves on a single platform. One valve dispenses the dam, a second valve encapsulates the cavity. http://www.nordsonasymtek.com
Training Courses | | | PCB Design Courses
The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.
Training Courses | | | Other Courses
Other courses related to electronics manufacturing and assembly
Events Calendar | Sun May 03 18:30:00 UTC 2020 - Sun May 03 18:30:00 UTC 2020 | ,
Ball Grid Array Rework - How to Do It Successfully
Career Center | , | Engineering
A well respected, cutting edge technology leader in underfill chip scale packaging electronic materials for uses in cell phone, wireless applications and more is in need of a particular combination of experience in process engineering, CSP equipment
Career Center | Boise, Idaho USA | Engineering
In need of a contract engineer ASAP!! This person will help with the fabrication of implantable medical devices. Incumbent must have electronic packaging and uBGA experience. The qualifications are below. This position will be from 3-9 months and nee
Career Center | Sarasota, Florida USA | Engineering,Management,Production,Purchasing,Quality Control,Research and Development,Sales/Marketing,Technical Support
SIX SIGMA GREEN BELT, LEAN PROCESS MAPPING AND VALUE STREAM, TOC, DFM, DOE, TRAINING AND DEVELOPMENT, SUPERVISION, PERF. MANAGEMENT, CROSBY QUALITY, FMEA, LEAD-FREE, CSP, NO CLEAN
Career Center | Johnson City, New York USA | Engineering,Research and Development
I am currently pursuing my Master's degree in Mechanical Engineering at the State University of New York at Binghamton, NY and expect to graduate by May 2000. I have been working as a Graduate Research Associate since August 1998, for the CSP/DCA
Processing and Troubleshooting SMT, BGA, CSP and Flip Chip
1st Place Machinery Inc. | http://www.firstplacemachinery.com/firstplace_smt_pcb_pickandplace_philipsacm.html
Philips ACM Philips ACM Micro Placement Machine ID Number: M17570 Year 2000 Component Types: BGA, CSP, Flip Chips, Odds, Connector Optimal Run Rate
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC- 9701 specification for tin/lead solder alloys
