http://www.flason-smt.com/product/Samsung-SM481-Pick-and-Place-Machine.html Samsung SM481 Pick and Place Machine Samsung SM481 Pick and Place Machine Chip theoretical speed 39,000CPH 1650 X 1680 X 1530MM weight 1655KG Product description: Sam
http://www.flason-smt.com/product/Samsung-SM481-Pick-and-Place-Machine.html Samsung SM481 Pick and Place Machine Samsung SM481 Pick and Place Machine Chip theoretical speed 39,000CPH 1650 X 1680 X 1530MM weight 1655KG Product description: Sam
Used SMT Equipment | SMT Equipment
Product Name:Panasoinc high speed chip mounter NPM Product number: NPM1 Detailed product introduction NPM multifunction machine, SMT machine, machine with function function function, check the dispensing machine, is a multifunctional equipment
Used SMT Equipment | SMT Equipment
Product Name:Panasoinc high speed chip mounter NPM Product number: NPM1 Detailed product introduction NPM multifunction machine, SMT machine, machine with function function function, check the dispensing machine, is a multifunctional equipment
Industry News | 2009-04-09 23:00:29.0
2009 will be an interesting and exciting year for us at Etek Europe Ltd. Although our customers in the UK & Central & Eastern Europe have experienced a slow down in the last few months, we are still finding opportunities out there.
Industry News | 2009-06-02 14:13:36.0
With the majority of the electronics industry fully on board with lead-free manufacturing, solder paste materials requirements are now moving beyond basic functionality and toward more advanced, truly enabling capabilities.
Technical Library | 2015-12-31 15:19:28.0
Today's consumer electronic product are characterized by miniatuization, portability and light weight with high performance, especially for 3G mobile products. In the future more fine pitch CSPs (0.4mm) component will be required. However, the product reliability has been a big challenge with the fine pitch CSP. Firstly, the fine pitch CSPs are with smaller solder balls of 0.25mm diameter or even smaller. The small solder ball and pad size do weaken the solder connection and the adhesion of the pad and substrate, thus the pad will peel off easily from the PCB substrate. In addition, miniature solder joint reduce the strength during mechanical vibration, thermal shock, fatigue failure, etc. Secondly, applying sufficient solder paste evenly on the small pad of the CSP is difficult because stencil opening is only 0.25mm or less. This issue can be solved using the high end type of stencil such as Electroforming which will increase the cost.
ALPHA® Preforms with solder paste adds solder volume.
SMT Express, Volume 4, Issue No. 9 - from SMTnet.com Volume 4, Issue No. 9 Thursday, September 19, 2002 SMTnet Announcement SMTnet Assembles Professional Focus Group SMTnet invites you to join a focus group of your peers to evaluate proposed
SMTnet Express, December 31, 2015, Subscribers: 23,946, Members: Companies: 14,865, Users: 39,660 Study on Solder Joint Reliability of Fine Pitch CSP Yong Hill Liang, Hank Mao, YongGang Yan, Jindong (King) Lee; AEG, Flex (Flextronics International
