The phoenix microme|x is a high-resolution 180 kV microfocus X-ray inspection system for real time inspection of solder joints and electronic components as well as for automated inspection (µAXI). Innovative and unique features and an extreme high po
Used SMT Equipment | X-Ray Inspection
Nordson DAGE XD7600NT Ruby X-ray inspection system Year 2014 Options: μCT (3D Inspection); X-Plane® & Secondary Monitor Nordson DAGE NT500 Maintenance-Free, Sealed-Transmissive X-ray Tube Proveable 160 kV Tube with Up to 10 W Target Power
Industry News | 2021-03-25 05:37:12.0
Productronica China 2021 was held as scheduled at Shanghai New International Expo Center last week. As the leading event of Asian electronics manufacturing industry, The customers from all over the country came in an endless stream. Unicomp Technology was presented at booth 5202 in Hall E5, demonstrating its advanced X-ray detection technology in the field of electronics manufacturing, bringing innovative products and integrated solutions to customers.
Industry News | 2021-03-04 03:51:49.0
The Productronica China will be held at the Shanghai New International Expo Center from March 17-19, 2021.
#Xray#Inspection#SEC Nano-focus Tube of 200 nano resolution which is specialized for sub-micron defects of Semiconductor Packaging, Wafer Level Packaging(WLP). -Non-destructive Analysis System -High-Resolution Image with Dual Type CTs -Application
Industry News | 2009-12-07 19:50:44.0
October 2009 — VJ Electronix, Inc., the leader in rework technologies and global provider of advanced X-ray inspection systems, announces that it will participate and propose X-ray and Rework solutions in Hall A4, Stand 533 at the upcoming Productronica exhibition, scheduled to take place November 10-13, 2009 at the New Munich Trade Fair Center in Munich, Germany.
Industry News | 2009-12-07 19:52:34.0
October 2009 — VJ Electronix, Inc., the leader in rework technologies and global provider of advanced X-ray inspection systems, announces that it will participate and propose X-ray and Rework solutions in Hall A4, Stand 533 at the upcoming Productronica exhibition, scheduled to take place November 10-13, 2009 at the New Munich Trade Fair Center in Munich, Germany.
Technical Library | 2016-05-30 22:24:00.0
As a part of series of studies on X-Ray inspection technology to quantify solder defects in BGA balls, we have conducted inspection of 3 level POP package by using a new AXI that capable of 3D-CT imaging. The new results are compared with the results of earlier AXI measurements. It is found that 3D measurements offer better defect inspection quality, lower false call and escapes.
Used SMT Equipment | X-Ray Inspection
Viscom x-ray inspection Highlights •2D and 3D X-ray inspection without mechanical conversion •Designed for larger, heavier inspection objects •Precision manipulation system with up to 8 CNC-capable axes •High magnification with angled radiation
