Electronics Forum | Mon Aug 06 17:29:07 EDT 2007 | gsala
Hi Gents, I heard people having concernes by using 2512R SMD resistors due to potential solder joint reliability defect(CTE mismach among ceramic/alumina+solder+PCB) when soldered by lead free alloys (SAC like). Any experience/news about solder j
Electronics Forum | Sun May 24 21:12:59 EDT 2009 | keith78
I have a problem recently to qualify QFN package on solder joint reliability. The pcb thickness stated in IPC-9701 is 2.35mm but from the in-house test, QFN surface mount on 2.35mm thickness PCB board have a short cycle to failure due to higher CTE m
Electronics Forum | Wed Sep 30 11:32:45 EDT 2009 | pbarton
What type of conformal coating are you using and are you allowing the coating to migrate under the device in question? If you are allowing the coating unbder the BGA the problem could be CTE of coating is much greater than that of the BGA balls/sold
Electronics Forum | Thu Feb 11 08:14:41 EST 2010 | scottp
It's OK to have the daisychain done in the interposer rather than the die (and a lot cheaper) but in thermal cycling the parts MUST have representative die. That's where a large part of the CTE mismatch comes from to cause fatigue damage. Thermal c
Electronics Forum | Thu Feb 11 12:02:47 EST 2010 | plaiming
We have temporarily switched to an RTV for the vibration reincforcement, but it is not compatible with acrylic conformal coating and we really do not want to switch conformal coatings to a silicone based. Additionally we are testing the product in h
Electronics Forum | Wed Oct 29 06:17:45 EDT 2014 | julianf
As stated in the title I would like to know the thermo-elastic material properties, most preferably the E-modulus and CTE in x- and y-direction, for Epoxy/E-glass laminates and/or prepregs for various fibreglass cloth styles. Datasheets only give ro
Electronics Forum | Wed Oct 25 10:33:08 EDT 2000 | Chris
I need to know the advantages or disavantages of a plastic or FR4/Flex based BGA over the ceramic based BGA. We have a BGA package we are going to have produced. Some want to have it made out of ceramic because they feel a ceramic package will be a
Electronics Forum | Wed Oct 04 14:46:46 EDT 2000 | Kal. Chak.
Hi folks, What are the differences between Epoxy resin(ER)conformal coating and adhesive stacking/bonding material? My PSA/PRA (Post solder/reflow assembly)bracket assembly process got some ER adhesive encroachment on pads/solderjoints. I have chec
Electronics Forum | Thu Sep 07 15:24:29 EDT 2000 | Murad Kurwa
Steven, Try http://www.document-center.com/home. You will find various standards for BGAs freely-available but not for free. BTW, I have never seen a BGA underfilled. Only FC and CSPs. The standards available will explain when to.....High CTE delta
Electronics Forum | Mon Aug 21 20:20:18 EDT 2000 | Dave F
Hi CJ: I guarantee you that the portions of you BGA that will physically move the most as a result of changing temperature are the corners. For this very reason, many BGA have BT substrates that have a tg of 210�C. I would demonstrate the potentia
