Si-Al alloy with a CTE of 6.7ppm/C. This can be supplied as plate or block, or machined and plated to a finished component. Used in satellite microwave packages, avionics, PCIMs etc.
As above with a CTE of 11ppm/C. More robust material that is used for structural applications, housings etc.
Industry News | 2012-01-13 13:20:53.0
Zymet has introduced a new reworkable underfill encapsulant, CN-1736, designed to underfill 0.4-mm pitch Package-on-Package (POP) assemblies. It has low viscosity and a lower CTE than its predecessors. Plus it has greater flux compatibility, making it suitable for use with a broader range of solderpastes and tacky fluxes.
For encapsulation of wirebonded IC’s Zymet's glob top and dam-and-fill encapsulants are UV curable, yet they have properties similar to conventional heat cured encapsulants, high Tg’s and low CTE’s. With UV cure, curing is performed quickly, inline
http://yincae.com/index.html YINCAE SMT 256 Dipping Process YINCAE SMT 266 Jetting Process
Precision Engineered Ceramics, Inc. produces precision machined ceramic spares for semiconductor wafer processing equipment. In addition, we offer fast delivery of complex geometry ceramic components made from high purity aluminum oxide (alumina).
STABLCOR� is a Thermally Managed PCB / Substrate material technology with many benefits: High Thermal Conductivity with a product family that ranges from 100 W/m K up to 1000 W/m K Can more closely match the CTE mismatch that is common today bet
Thermally Managed � Heat Dissipating PCB�s (Printed Circuit Boards) By STABLCOR Corporation STABLCOR TM Printed Circuit Board Material Product Information STABLCOR Corporation has developed a new printed circuit board technology that has the followin
Industry Directory | Manufacturer
United Adhesives makes special adhesives, coatings, potting gels, sealants, various conductive adhesives, and optical adhesives for applications in electronics, semiconductors, and telecommunications.
Industry News | 2002-07-30 15:53:01.0
July 30, 2002
