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YINCAE SMT 266 Jetting Application Process

YINCAE SMT 266 Jetting Application Process

Videos

http://yincae.com/index.html YINCAE SMT 256 Dipping Process YINCAE SMT 266 Jetting Process

YINCAE Advanced Materials, LLC.

High reliability Copper Clad Laminate

High reliability Copper Clad Laminate

New Equipment |  

170 oC) Phenolic cured (Dicy Free) system with inorganic filler High Td (decomposition temp. > 340 oC by TGA) Lead free process compatible (260 oC IR reflow 6x + 288 oC solder flow 3x, no delamination) Low Coefficient of Thermal Expansion ( 60 min. T

Mica-AVA (Far East) Industrial Ltd

Isola - High Performance PCB Laminates

Isola - High Performance PCB Laminates

New Equipment | Materials

FR408 High Speed, Low Loss Modified Epoxy FR408 is a high-performance FR-4 modified epoxy laminate & prepreg system designed for advanced circuit applications. Its low dielectric constant and low dissipation factor make it an ideal candidate for br

INSULECTRO

KIC Aluminum Tape - Solution for Reliable Thermocouple Attachment

KIC Aluminum Tape - Solution for Reliable Thermocouple Attachment

New Equipment | Components

Don't Sacrifice PCBs for Profiling Double Sided Thermally Conductive Tape Used for Attaching Thermocouples to PCBS. Non-destructive TC attachment Reliable TC readings No waiting for curing or soldering Fast, easy setup Sold in 1

KIC Thermal

Underfill FF35

Underfill FF35

New Equipment | Materials

Underfill FF35 is a low surface tension, one component epoxy resin designed for use as a capillary flow underfill for flip chip, CSP, BGA and uBGA assemblies. Underfill FF35 offers excellent capillary action for flat, fast and complete spread. Underf

AIM Solder

LEN 66A Optical Bonding Adhesive

LEN 66A Optical Bonding Adhesive

New Equipment | Materials

LEN 66A is one part 100% solid, super fast UV curable bonding adhesives, which has been designed for lens attachment, protective cover windows and touch screens. It can also be used for LCD lamination and sealing, polarizer lamination and touch scree

YINCAE Advanced Materials, LLC.

BP 256 Ball Attach Adhesive

BP 256 Ball Attach Adhesive

New Equipment | Materials

BP 256 ball attach adhesives have been designed to enhance solder joint reliability and eliminate cleaning process for ball bumping process of CSP, BGA, Flip chip and PoP (package on package) and so on, particularly for lead free application. During

YINCAE Advanced Materials, LLC.

Precision Engineered Ceramics, Inc.

Industry Directory |

Precision Engineered Ceramics, Inc. produces precision machined ceramic spares for semiconductor wafer processing equipment. In addition, we offer fast delivery of complex geometry ceramic components made from high purity aluminum oxide (alumina).

High frequency circuit boards

High frequency circuit boards

New Equipment | Board Handling - Storage

We have made the Rogers 4350B core pcb boards. from 2 layer to 30 layers. We have many kinds Rogers base pcb materials. RO4000® Series High Frequency Circuit Materials (ALCANTA PCB Web: alcantapcb.com) RO4000® hydrocarbon ceramic laminates

ALCANTA TECHNOLOGY(SHENZHEN)CO.,LTD

United Adhesives, Inc.

Industry Directory | Manufacturer

United Adhesives makes special adhesives, coatings, potting gels, sealants, various conductive adhesives, and optical adhesives for applications in electronics, semiconductors, and telecommunications.


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