Electronics Forum | Sun Dec 17 17:40:49 EST 2006 | darby
Thanks AJ, It is looking like a CTE issue.
Electronics Forum | Fri Mar 19 12:22:36 EDT 2010 | stepheniii
Could it be a CTE mismatch issue?
Electronics Forum | Tue Jun 25 01:24:25 EDT 2019 | sssamw
That is possibley CTE mismatch between QFN and PCB material, the thicker PCB the higher fail rate.
Electronics Forum | Mon May 16 22:59:40 EDT 2005 | davef
We believe your problem is caused by the mismatch in CTE of the material ised in your BGA. In fact, this "potato chipping" [where the corners curl-up] is present in all BGA. The issue is the matter of degree. [Mismatching CTE is how old thermostats
Electronics Forum | Wed Aug 03 21:20:09 EDT 2005 | Ken
CTE mismatch. X, Y, Z all expand at different rates. Cooling or heating rates will not change this CTE mismatch. Layer counts, power plane ballance, equal run lengths in x-y and copper balance all contribute. Have your supplier evaluate your s
Electronics Forum | Thu Jun 25 15:33:51 EDT 1998 | Earl Moon
| | Hi there, | | Does any one know what is TCE for fully wet saturated FR4. I came to know that for Dry FR4 the TCE is about 15-19 PPM �C. Is that true? | | | | Appreciated for your help. | | rgs, | | chiakl | Chiakl, | It looks like you are speaki
Electronics Forum | Wed Feb 02 22:10:30 EST 2005 | T2
Higher Tg values are only one thing to look out for. Two other things that are very important to watch are the Td or Decomposition Temperature (the temperature that the epoxy actualy starts to break down), and the CTE for the material. Some Tg 14
Electronics Forum | Wed Jul 26 18:23:47 EDT 2000 | Gary
I have been following forum discussions here and eslewhere, attended technical sessions at APEX and have been experimenting with the paste-in-hole process on some of our new product. I have run into one problem I have never seen mentioned, that is a
Electronics Forum | Tue Dec 28 12:34:03 EST 1999 | Justin Medernach
Jim, I wouldn't sweat a TCE mismatch between Ceramic chip components and FR4. No need to worry. 99.5% of consumer product out there utilizes this exact technology with no threat of failure due to CTE mismatch. The terminices of the components occu
Electronics Forum | Sat Nov 23 10:19:39 EST 2002 | davef
This sounds alot like the warping that we all see periodically in BGA. CTE of material is temperature dependent and not temperature changing rate dependent, so you are pretty much hosed by the physics. Regardless, I do like trying like crazy to g
