Electronics Forum | Thu Aug 31 12:17:56 EDT 2000 | mike weekes
We are considering alternative Board Finishes to our existing HASL process. The HASL effects opens on 25 and 20 mil packages after reflow and we know if the advantages of CuOSP and other alternatives. OUR Concern: Is there a shelf life and handlin
Electronics Forum | Sun Jun 06 09:20:03 EDT 2004 | michaeljm
My department and I have been working with immersion silver on and off for about four years and we have compiled quite a bit of data for the Alpha and MacDermid immersion silver chemistries. We have not encountered any assembly or storage related is
Industry News | 2018-06-03 19:11:33.0
SHENMAO America, Inc. is exhibiting at the 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), taking place May 29 - June 1, 2018 at the Sheraton San Diego Hotel & Marina. SHENMAO plans to showcase its new PF906-S and PF912-S solder alloys, and SMF-WC53 Water-Soluble / Cu-OSP Pad Ball Attach Flux.
Surface Mount Technology Association (SMTA) | https://www.smta.org/icsr/speaker_forms/Paper-Format-Requirements.doc
experiments in this study were performed on an OSP finished board. Finishes such as OSP which do not have a nickel later represent the worst case scenario with respect to Cu dissolution. An OEM server product was used as the test vehicle throughout this study
Imagineering, Inc. | https://www.pcbnet.com/quote/board-quote-usa/
* Materials FR4(130Tg) FR4(170Tg) FR4(180Tg) from Taiwan or China Copper Weight 1 oz 2 oz 3 oz 4 oz Cu from Taiwan or China Finish Plating ENIG1U" (Immersion Gold) HASL (Leaded
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