Technical Library | 2010-07-08 19:49:59.0
Aging characteristics of new lead free solder alloys are in question by many experts because of higher amount of tin’s effect on the diffusion of other metals, primarily copper, to create undesirable boundary intermetallics over long periods of time and even moderately elevated temperatures. A primary layer of intermetallics, Cu6Sn5 forms as the liquid solder makes contact with the solid copper substrate. This reaction however ceases as the solder temperature falls below that of liquidus. A secondary intermetallic Cu3Sn1, an undesirable weak and brittle layer, is thought to form over time and may be accelerated by even mildly elevated temperatures in electronic modules such as laptops under power. This project was designed to quantify the growth rate of Cu3Sn1 over an extended period of time in a thermal environment similar to a laptop in the power on mode.
Industry News | 2012-01-13 12:42:50.0
Nihon Superior Co. Ltd., a supplier of advanced soldering materials to the global market, announces that Senior Technical Advisor Keith Sweatman will present “The Stability of Cu6Sn5 in the Formation and Performance of Lead-free Solder Joints” at the SMTA Pan Pacific Microelectronics Symposium.
Industry News | 2012-02-07 16:20:22.0
Nihon Superior announces that its Senior Technical Advisor Keith Sweatman will present the paper titled “Effect of Cooling Rate on the Intermetallic Layer in Solder Joints” at the upcoming IPC APEX Expo.
Technical Library | 2014-07-02 16:46:09.0
Growth behaviors of intermetallic compounds (IMCs) and Kirkendall voids in Cu/Sn/Cu microbump were systematically investigated by an in-situ scanning electron microscope observation. Cu–Sn IMC total thickness increased linearly with the square root of the annealing time for 600 h at 150°C, which could be separated as first and second IMC growth steps. Our results showed that the growth behavior of the first void matched the growth behavior of second Cu6Sn5, and that the growth behavior of the second void matched that of the second Cu3Sn. It could be confirmed that double-layer Kirkendall voids growth kinetics were closely related to the Cu–Sn IMC growth mechanism in the Cu/Sn/Cu microbump, which could seriously deteriorate the mechanical and electrical reliabilities of the fine-pitch microbump systems
Industry News | 2010-09-02 10:54:09.0
Nihon Superior Co. Ltd., a supplier of advanced soldering materials to the global market, announces that the research it sponsored at the University of Queensland, Australia provided the basis for the paper that earned an ICEP Outstanding Paper Award.
Industry News | 2011-03-01 16:38:55.0
Nihon Superior Co. Ltd. announces that Keith Sweatman, Senior Technical Advisor, will present a paper titled "The Stability Window and Mechanical Properties of the Interfacial Intermetallic in Lead-free Solder Joints" at the upcoming TMS 2011 Annual Meeting & Exhibition.
Industry News | 2011-10-16 00:20:48.0
Nihon Superior announces that Keith Sweatman will present a paper titled “The Effect of Microalloy Additions on the Morphology and Growth of Interfacial Intermetallic in Low-Ag and No-Ag Pb-Free Solders” at the upcoming SMTA International 2011.
Industry News | 2013-09-17 15:25:45.0
Nihon Superior announces that its Senior Technical Advisor Keith Sweatman will present at SMTA International, which is scheduled to take place October 12-17 at the Fort Worth Convention Center in Texas.
Electronics Forum | Thu Nov 03 13:35:46 EST 2005 | Amol
the copper forms intermetallics with tin to get Cu3Sn and Cu6Sn5. thus intermetallics formation consumes Cu and depends upon the cooling rate, faster the cooling rate, lesser the intermetallic formation
Electronics Forum | Wed Sep 03 07:43:13 EDT 2008 | davef
What do you mean by a "few micron thick"? IMC thickness pre-cycling (NEMI Lead-free) * Cu3Sn: 3um [118 uin] * Cu6Sn5: 1um [40 uin]
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