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Nordson MARCH Introduces Plasma Treatment System with 2-Meter Depth for Improved Manufacturing of Extended Catheters and Larger Products

Industry News | 2020-01-15 15:51:08.0

Nordson MARCH, a Nordson company introduces the PROGENY™ plasma treatment system with a chamber that is 2 meters deep with overall dimensions of 660mm W x 2260mm D x 660mm H for plasma treatment of catheters at their full extended length. Plasma cleans and activates the surface prior to applying a lubricious coating and provides adhesive bonding of the balloon to the catheter. It removes contamination, impurities, and organics at the nanometer level and improves surface wettability, hydrophilicity, and bonding capabilities to address issues such as poor wetting, poor coating uniformity, voids, and poor adhesion.

MARCH Products | Nordson Electronics Solutions

Nordson MARCH Receives Vision and Innovation Awards at NEPCON China for its RollVIA Self-contained Vacuum Plasma System

Industry News | 2018-05-31 10:23:37.0

Nordson MARCH announces that it has received the VISION Award from SMT China magazine and the Innovation Award from Electronics Manufacturing (EM) Asia magazine for its new-generation RollVIA™ plasma system. The awards were presented at NEPCON China, held in the Shanghai EXPO World Center, Shanghai, China, on April 24 and 25, 2018. The RollVIA™ plasma system is used for plasma applications such as surface activation for improved adhesion, carbon removal and descum/desmear for cleaner surfaces, and etchback, which removes a slight amount of dielectric contamination between internal copper planes during printed circuit board (PCB) production. The RollVIA provides uniform plasma treatment of substrates as thin as 25 microns.

MARCH Products | Nordson Electronics Solutions

Parent company of Anda Technology USA, Inc. celebrates a successful listing on the Science and Technology Innovation Board of the Shanghai Stock Exchange

Industry News | 2022-05-05 17:25:16.0

On April 15, the listing ceremony of Guangdong Anda Automation Solutions Co. Ltd. (Anda Automation SHSE stock code: 688125) was held at the Hyatt Regency Hotel in Songshan Lake, Dongguan. All levels of government representatives in Dongguan, representatives of the company's actual controllers and shareholders, intermediaries, listing associations, partners, company management team and special guests attended the ceremony.

Anda Automation Pte Ltd

seperation of soldermask and pcb

Electronics Forum | Wed Mar 19 08:38:13 EDT 2014 | davef

I can't picture much of what you're saying, not for nothing, I'm just not connecting. During assembly, solder mask can affected by heat and chemicals. Typically this would be during: * Soldering * Cleaning I will tell you this: Not to defend assem

seperation of soldermask and pcb

Electronics Forum | Tue Mar 25 13:55:05 EDT 2014 | horchak

Ok lets put it this way. If the PCB house used a high quality mask and properly applied it to a properly cleaned surface and properly cured it, then as Dave stated above there are only two things that can destroy it. Excessive heat and overly aggress

seperation of soldermask and pcb

Electronics Forum | Tue Mar 25 08:29:33 EDT 2014 | sara_pcb

Please refer the attached jpegs, The problem is noticed after reflow soldering followed by conventional through hole soldering. Flux used one is MIL Std. Brush cleaning in IPA is followed after each soldering step. regards, R.Saravanan

Discoloring of Soldermask and silkscreen

Electronics Forum | Mon Apr 12 19:28:26 EDT 1999 | Tom B

Netters, When I reflow a PCB there is a discoloration of silkscreen and mask. It appears if Profile is too hot! But I dont think so, maybe I'm wrong? 1. Kester 293 no clean 2. 2.1 C/s for 30s to 150 C 3. .5 - .7 C/s for 60s to 185 C 4. 1.5 C/s u

Cracking Capacitors and Solder Balls

Electronics Forum | Mon Jun 08 14:19:30 EDT 1998 | Gary Simbulan

Earl, et al, Boy things get old and cold around here fast. I promised more detail on my capactior problem and I thought I could drop something completely different in the same message and tell a tale of solder balls. First the caps. We still have

No Clean and Underfill

Electronics Forum | Fri Mar 19 10:27:42 EDT 2010 | karlo

No clean pastes leave more flux residues. These can result in void formation and inhibtion of underfill curing. Selection of an underfill that is compatible with the flux residue is important. One company that has written about the effect of flux

COB and wire bond

Electronics Forum | Mon May 07 22:29:52 EDT 2001 | davef

4 wire per sec ... you figure how many you need] Encapsulation ~$120K for a dispenser [10 sec per die ... you figure how many you need] plus a cure oven ~$100k Throw in a another ~$100k for marking and cleaning Check the September 2000 SMTnet New


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