Industry Directory | Manufacturer
Reflow ovens for automated SMT PCB assembly, specializing in lead free processing and nitrogen reflow. The best convection reflow ovens on the market.
General curing, die attach curing, underfill curing, film & tape bonding, wafer laminating.
New Equipment | Curing Equipment
A Pressure Cure Oven (PCO), or Autoclave, is used to minimize voiding and increase adhesion strength for bonding processes typically used in die attach and underfill applications. PCO pressurizes air into a rigid vessel and heats & cools with
New Equipment | Curing Equipment
Heller 788 In-line, Continuous Cure, Vertical Format Oven This elevator format oven utilizes vertical space to accomodate curing applications of up to 4 hours while only occupying 96" (2.5m) of floorspace. Perfect for underfill and encapsulant.
New Equipment | Curing Equipment
The mini vertical oven has a cycle time of 25 - 60 seconds per 150mm fixture, 4mm Edge Hold Pins and Guides. PCBs up to 250mm wide can be processed. Dual Feed option for high throughoutput. In-line, vertical automation of the epoxy cure process prod
This elevator format oven utilizes vertical space to accomodate curing applications of up to 4 hours while only occupying 96" (2.5m) of floorspace. Perfect for underfill and encapsulant.
Increase productivity, improve quality, reduce costs with vertical format curing solutions from Heller Industries. Learn more: http://www.hellerindustries.com/755-Vertical-Oven.php
Used SMT Equipment | Soldering - Reflow
10 Heat Zones Voltage: 380V Max PCB size: 18" Feed Direction: L-R Additional Options: EHC, Fan Speed Control
Used SMT Equipment | Soldering - Reflow
12 Heat Zones Voltage: 400V Max PCB size: 18" Feed Direction: L-R Additional Options: EHC, CBS, CE, Gen 5.1
Used SMT Equipment | Soldering - Reflow
8 Heat Zones Voltage: 480V Max PCB size: 18" Feed Direction: L-R Additional Options: EHC
